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1 |
Properties of Light-weight Expanded Bonded Leather Using Thermal Expandable Microspheres
Shin, Eun-Chul;Kim, Won-Ju;Kim, Yeong-Woo;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.81-85,
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2 |
Improving Charge Injection Characteristics and Electrical Performances of Polymer Field-Effect Transistors by Selective Surface Energy Control of Electrode-Contacted Substrate
Choi, Giheon;Lee, Hwa Sung;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.86-92,
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3 |
Solvent-free UV-curable Acrylic Adhesives for 3D printer build sheet
Lee, Bae Hwa;Park, Dong Hyup;Kim, Byung Jick;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.93-100,
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4 |
Improving Charge Injection Characteristics and Electrical Performances of Polymer Field-Effect Transistors by Selective Surface Energy Control of Electrode-Contacted Substrate
Jang, Jeong Beom;Kim, Taehee;Kim, Hye Jin;Lee, Wonjoo;Seo, Bongkuk;Kim, Yongsung;Kim, Changyoon;Lim, Choong-Sun;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.101-106,
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5 |
High-performance WSe2 field-effect transistors fabricated by hot pick-up transfer technique
Kim, Hyun Ho;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.107-112,
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6 |
Periodic Mesoporous Organosilicas
Park, Sung Soo;Ha, Chang-Sik;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.113-122,
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7 |
Application of Polysilsesquioxane to Pressure-sensitive Adhesives and Adhesives
Mikihiro, Kashio;Sugizaki, Toshio;Osamu, Moriya;
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The Society of Adhesion and Interface, Korea
, v.21, no.3, pp.123-128,
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