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| 1 |
Effects of the Ordering Reaction on High Temperature Mechanical Behavior in Alloy 600
Kim, Sung Soo;Kim, Dae Whan;Kim, Young Suk;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.703-710,
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| 2 |
Effect of Aging Treatment on the Microstructure and Tensile Properties of AZ61-xPd (x = 0, 1 and 2 wt%) Alloys
Kim, Sang Hyun;Kim, Byeong Ho;Park, Kyung Chul;Park, Yong Ho;Park, Ik Min;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.711-720,
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| 3 |
Reliability Evaluation on Creep Life Prediction of Alloy 617 for a Very High Temperature Reactor
Kim, Woo-Gon;Park, Jae-Young;Kim, Seon-Jin;Hong, Sung-Deok;Kim, Yong-Wan;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.721-728,
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| 4 |
Effect of Water Absorption on the Tensile Properties of Carbon-Glass/Epoxy Hybrid Composite in Low Temperature
Jung, Hana;Kim, Yonjig;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.729-734,
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| 5 |
Effects of the Cooling Rate After Annealing Treatment on the Microstructure and the Mechanical Properties of Super-Duplex Stainless Steel
Kwon, Gi-Hyoun;Na, Young-Sang;Yoo, Wee-Do;Lee, Jong-Hoon;Park, Yong-Ho;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.735-743,
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| 6 |
Effect of TiCl4 Feeding Rate on the Formation of Titanium Sponge in the Kroll Process
Lee, Jae Chan;Sohn, Ho Sang;Jung, Jae Young;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.745-751,
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| 7 |
Study on the Reduction of Molten EAF Slag
Joo, Seong-Woong;Shin, Jong-Dae;Shin, Dong-Kyung;Hong, Seong-Hun;Ki, Jun-Sung;Hwang, Jin-Il;You, Byung-Don;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.753-761,
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| 8 |
Fabrication of PCL/MWCNTs Nanofiber by Electrospinning
Choi, Jung Mi;Jang, Hyun Chul;Hyeon, Jae Young;Sok, Jung Hyun;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.763-768,
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| 9 |
Development of Mg-xFe2O3-yNi Hydrogen-Storage Alloys by Reactive Mechanical Grinding
Song, Myoung Youp;Kwon, Sung Nam;Park, Hye Ryoung;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.769-774,
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| 10 |
Effect of Intermetallic Compounds Growth Characteristics on the Shear Strength of Cu pillar/Sn-3.5Ag Microbump for a 3-D Stacked IC Package
Kwak, Byung-Hyun;Jeong, Myeong-Hyeok;Park, Young-Bae;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.775-783,
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| 11 |
A Flip Chip Process Using an Interlocking-Joint Structure Locally Surrounded by Non-conductive Adhesive
Choi, Jung-Yeol;Oh, Tae-Sung;
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The Korean Institute of Metals and Materials
, v.50, no.10, pp.785-792,
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