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| 1 |
Deformation Behavior of a Wrought Mg-Zn-RE Alloy at the Elevated Temperatures
Shin, Beomsoo;Kim, Yule;Bae, Donghyun;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.1-5,
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| 2 |
Application of Nanoparticles for Materials Recognition using Peptide Phage Display Technique- Part I: Preliminary study using LaPO4 and TiO2 nanoparticles
Lee, Chang-Woo;Kim, Min-Jung;Standaert, R.;Kim, Seyeon;Owens, E.;Yan, Jun;Choa, Yong-Ho;Doktycz, M.;Lee, Jai-Sung;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.6-12,
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| 3 |
Study on the Distillation of Magnesium Alloy Scrap
Wi, Chang-Hyun;Yoo, Jung-Min;Jang, Byoung-Lok;You, Byoung-Don;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.13-19,
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| 4 |
Ionic Equilibria in Mixed Solutions of Cuprous and Cupric Chloride
Lee, Man Seung;Nicol, M.J.;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.20-25,
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| 5 |
A Study on the Traditional Forged High Tin Bronzes and the Rivet Joints in Korea
Lee, Jae Sung;Kim, Won Soo;Park, Jang Sik;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.26-32,
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| 6 |
Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump
Kim, Yu-Na;Koo, Ja-Myeong;Park, Sun-Kyu;Jung, Seung-Boo;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.33-38,
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| 7 |
Silicon On Insulator (SOI) Wafer Development using Plasma Source Ion Implantation (PSII) Technology
Jung, Seung-Jin;Lee, Sung-Bae;Han, Seung-Hee;Lim, Sang-Ho;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.39-43,
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| 8 |
Effects of Magnetic Powder Size on Electromagnetic Wave Absorption Characteristics in FeSiCr Flakes/Polymer Composite Sheets
Noh, Tae-Hwan;Kim, Ju-Beom;
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The Korean Institute of Metals and Materials
, v.46, no.1, pp.44-51,
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