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| 1 |
On the Crystallographic Features of Cr2N Precipitates in High-Nitrogen AusteniticStainless Steel (V)V. Neutron diffraction study on the ordered Cr2N superstructure
이태호;김성준;신은주;;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.533-541,
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| 2 |
Effects of Microstructural Variables on Tensile Behavior of A356 CastAluminum Alloy Using Linear Regression Analysis Method
홍성진;김상식;이재현;권용남;이영선;이정환;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.542-548,
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| 3 |
Dry Sliding Wear Properties of A356-20 vol.%SiCpcomposites coated by micro-arc oxidation
;;Han, Jianmin;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.549-555,
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| 4 |
Texture Evolution According to the Film Thickness of Annealed Cu Films Depositedby Sputtering and Electro-deposition
이상훈;박노진;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.556-561,
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| 5 |
Effect of Microstructure on Electrical and Optical Properties ofITO Thin Films Deposited by D.C. Magnetron Sputtering (I)
최용락;김선화;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.562-568,
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| 6 |
Effect of Microstructure on Electrical and Optical Properties ofITO Thin Films Deposited by D.C. Magnetron Sputtering (Ⅱ)
최용락;김선화;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.569-574,
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| 7 |
The Effect of Additives and Current Density on the Copper Electrodeposition usingGalvanostatic Mode
우태규;설경원;이현우;박일송;윤영민;윤정모;우경녕;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.575-580,
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| 8 |
Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints-(1)Pb-bearing Solder
김종웅,;;;;;;;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.581-586,
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| 9 |
Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints-(2)Pb-free Solder
김종웅;김대곤;정승부;
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The Korean Institute of Metals and Materials
, v.44, no.8, pp.587-594,
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