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| 1 |
Effect of  Martensite on the Damping Capacity of Austenitic Stainless Steel
Son, Dong-Uk;Kim, Jae-Hwan;Kim, Ick-Soo;Kazuya, Miyahara;Sung, Jang-Hyun;Kang, Chang-Yong;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.621-625,
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| 2 |
Numerical Analysis of Hydrogen Removal Kinetics During Thermohydrogen Processing of Titamium
Chung, Soon-Hyo;Ha, Heon-Phil;Byun, Ji-Young;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.626-633,
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| 3 |
Fabrication and Microstructural Analysis of  Surface Composites Using High-Energy Electron Beam Irradiation
Yun, Eun-Sub;Lee, Sung-Hak;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.634-642,
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| 4 |
Visualization of Crack Propagation and Bridging Stress using the Mechano-luminescence of 
Kim, Ji-Sik;Kwon, Young-Nam;Sohn, Kee-Sun;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.643-647,
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| 5 |
Thermal Stability and Mechanical Properties of TiAl-Nb Alloys Containing Si and C
Kim, Jeong-Hwan;Kim, Seong-Ung;Lee, Ho-Nyeon;Kim, Min-Cheol;O, Myeong-Hun;Wi, Dang-Mun;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.648-655,
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| 6 |
Embrittlement Behavior of Zirconium Alloy during Loss of Coolant Accident
Kim, Jun-Hwan;Lee, Jong-Hyuk;Choi, Byoung-Kwon;Jeong, Yong-Hwan;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.656-661,
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| 7 |
Finite Element Analysis for Instability and Necking Behaviour of Tensile Specimens
Kim, Hyoung-Seop;Kim, Sung-Ho;Ryu, Woo-Seog;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.662-666,
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| 8 |
Fabrication of Al-Mg/AlN Composites by Gas/Melt in-situ Reaction
Kim, Jae-Deuk;Euh, Kwang-Jun;Lee, Jung-Moo;Kang, Suk-Bong;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.667-672,
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| 9 |
Oxidation Behaviors of Ca Containing AZ91 Magnesium Alloys
Choi, Byung-Ho;You, Bong-Sun;Park, Won-Wook;Park, Ik-Min;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.673-678,
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| 10 |
Effect of Stress on Interconnect Reliability of Microelectronic Devices
Park, Young-Bae;Jeon, In-Su;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.679-684,
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| 11 |
The Effect of Manipulating Lead-on-Chip Package Design on Reliability of Semiconductor Devices
Lee, Seong-Min;
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The Korean Institute of Metals and Materials
, v.42, no.8, pp.685-689,
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