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| 1 |
Microstructure and Electrical Resistivity of Ink-Jet Printed Nanoparticle Silver Films under Isothermal Annealing
Choi, Soo-Hong;Jung, Jung-Kyu;Kim, In-Young;Jung, Hyun-Chul;Joung, Jae-Woo;Joo, Young-Chang;
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Materials Research Society of Korea
, v.17, no.9, pp.453-457,
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| 2 |
Effect of Oxygen in the Synthesis of ZnO Nanowires
Park, Kyung-Su;Choi, Young-Jin;Park, Jae-Gwan;Kang, Gyo-Sung;Lim, Dong-Gun;Park, Jae-Hwan;
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Materials Research Society of Korea
, v.17, no.9, pp.458-462,
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| 3 |
Interdiffusion in Cu/Capping Layer/NiSi Contacts
You, Jung-Joo;Bae, Kyoo-Sik;
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Materials Research Society of Korea
, v.17, no.9, pp.463-468,
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| 4 |
Pd Seed Layer for Electroless Cu Deposition on TaN Diffusion Barrier by Self-Assembled-Monolayer Method(SAM)
Han, Won-Kyu;Cho, Jin-Ki;Choi, Jae-Woong;Kim, Jeong-Tae;Yeom, Seung-Jin;Kwak, Noh-Jung;Kim, Jin-Woong;Kang, Sung-Goon;
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Materials Research Society of Korea
, v.17, no.9, pp.469-474,
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| 5 |
Growth of MnS Thin Film on c-Sapphire by Pulsed Laser Deposition
Song, Jeong-Hwan;
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Materials Research Society of Korea
, v.17, no.9, pp.475-479,
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| 6 |
Mechanical Properties of Hydroxyapatite β-TCP Composite with Changing SiO2 Contents
Ryu, Su-Chak;Min, Sang-Ho;Park, Young-Min;
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Materials Research Society of Korea
, v.17, no.9, pp.480-483,
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| 7 |
Characteristic of Copper Films on Molybdenum Substrate by Addition of Titanium in an Advanced Metallization Process
Hong, Tae-Ki;Lee, Jea-Gab;
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Materials Research Society of Korea
, v.17, no.9, pp.484-488,
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| 8 |
Optoelectronics Properties of In0.27Ga0.73N/GaN Multi-Quantum-Well Structure
Park, Hun-Bo;Bae, In-Ho;Kim, Ki-Hong;
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Materials Research Society of Korea
, v.17, no.9, pp.489-492,
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| 9 |
Effects of Preparation Conditions on Thermal and Electrical Properties of Oil-based Nanofluids for Transformer Application
Choi, Cheol;Yoo, Hyun-Sung;Oh, Jae-Myung;
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Materials Research Society of Korea
, v.17, no.9, pp.493-499,
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| 10 |
Simulation on the Microstructure Development of Porous Materials with Respect to the Surface Energy Anisotropy
Shin, Soon-Gi;
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Materials Research Society of Korea
, v.17, no.9, pp.500-506,
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