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| 1 |
Design and Prototyping of a Novel Type Piezoelectric Micro-pump
Oh, Jin-Heon;Lim, Jong-Nam;Lee, Seung-Su;Heo, Jun;Lim, Kee-Joe;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.181-185,
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| 2 |
Dependence of the Partial Discharge Characteristics of Ultra-high Voltage Cable Insulators on the Measuring Temperature
Shin, Jong-Yeol;Park, Hee-Doo;Lee, Hyuk-Jin;Lee, Kang-Won;Kim, Won-Jong;Hong, Jin-Woong;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.186-192,
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| 3 |
Design of Polycrystalline 3C-SiC Micro Beam Resonators with Corrugation
Chung, Gwiy-Sang;Nhan, Nguyen Duong The;Thach, Phan Duy;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.193-197,
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| 4 |
Electro-optical Characteristics of the One-side Rubbing TN-LCD on Polyimide Surface with Ion-beam Irradiation
Kim, Young-Hwan;Lee, Kang-Min;Kim, Byoung-Yong;Oh, Byeong-Yun;Han, Jeong-Min;Lee, Sang-Keuk;Seo, Dae-Shik;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.198-201,
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| 5 |
LC Orientation Characteristics Treated on Organic Hybrid Overcoat Layer with Ion Beam Irradiation
Lee, Sang-Keuk;Kim, Byoung-Yong;Kim, Young-Hwan;Lee, Kang-Min;Oh, Byeong-Yun;Han, Jeong-Min;Seo, Dae-Shik;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.202-205,
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| 6 |
Enhancement of Life Time for PCB (Printed Circuit Board) Drill Bit by Nitrogen Ion Implantation
Lee, Chan-Young;Lee, Jae-Sang;Kim, Bum-Suk;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.206-208,
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| 7 |
A Rapid and Simple Homogenizing Method for the Purification of Single-walled Carbon Nanotubes
Choi, Sang-Kyu;Jung, Seung-Il;Lee, Seung-Beck;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.209-212,
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| 8 |
A Vascular Characteristic Index of Blood Pressure Variation using the Pulse Wave Signal
Kim, Gi-Ryon;Jung, Dong-Keun;Ye, Soo-Young;Jeon, Gye-Rok;
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The Korean Institute of Electrical and Electronic Material Engineers
, v.9, no.5, pp.213-219,
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