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| 1 |
Welding and Joining Research Institute in World
Gang, Jeong-Yun;
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The Korean Welding and Joining Society
, v.23, no.5, pp.1-3,
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| 2 |
Analysis of Welding Phenomena and Effect of Short Circuit Current Rise Slope in the High Speed  Welding of Steel Sheets
Kim, Young-Sam;Ryoo, Hoi-Soo;Kim, Hee-Jin;
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The Korean Welding and Joining Society
, v.23, no.5, pp.14-19,
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| 3 |
Fatigue Strength Evaluation of Welded Box Type with HR Coil
Kang, Sung-Won;Kim, Myung-Hyun;Jang, Yong-Won;Lee, Jin-Woo;
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The Korean Welding and Joining Society
, v.23, no.5, pp.20-24,
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| 4 |
A Study on Laser Joining of Low Carbon Steel and Aluminum Alloy Part 1 : Process Parameters
Park, Tae-Wan;Cho, Jung-Ho;Na, Suck-Joo;
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The Korean Welding and Joining Society
, v.23, no.5, pp.25-29,
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| 5 |
A Study on Laser Joining of Low Carbon Steel and Aluminum Alloy Part 2 : Process Analysis
Park, Tae-Wan;Cho, Jung-Ho;Na, Suck-Joo;
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The Korean Welding and Joining Society
, v.23, no.5, pp.30-36,
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| 6 |
Non-contact Ultrasonic Inspection Technology of Fillet Weldments
Park, Ik-Keun;Lee, Chul-Ku;Kim, Hyun-Mook;Park, Tae-Sung;Kim, Yong-Kwon;Cho, Yong-Sang;Song, Won-Joon;Ahn, Houng-Kun;
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The Korean Welding and Joining Society
, v.23, no.5, pp.37-42,
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| 7 |
Long Range Ultrasonic Guided Wave Techniques for Inspection of Pipes
Park, Ik-Keun;Kim, Yong-Kwon;Kim, Hyun-Mook;Song, Won-Joon;Cho, Yong-Sang;Ahn, Yeon-Shik;
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The Korean Welding and Joining Society
, v.23, no.5, pp.43-48,
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| 8 |
Effective Charge Number and Critical Current Density in Eutetic SnPb and Pb Free Flip Chip Solder Bumps
Chae, Kwang Pyo;
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The Korean Welding and Joining Society
, v.23, no.5, pp.49-54,
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| 9 |
Analysis of Transmission Infrared Laser Bonding for Polymer Micro Devices
Kim, Joo-Han;Shin, Ki-Hoon;
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The Korean Welding and Joining Society
, v.23, no.5, pp.55-60,
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| 10 |
Joint properties and Interface Analysis of Friction Stir Welded Dissimilar Materials between Austenite Stainless Steel and 6013 Al Alloy
Lee, Won-Bae;Biallas, gehard;Schmuecker, Martin;Jung, Seung-Boo;
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The Korean Welding and Joining Society
, v.23, no.5, pp.61-68,
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