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| 1 |
차세대 SiP를 위한 3D TSV IC 기술
Park, Jun-Seo;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.20-28,
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| 2 |
Physical Design for 3D Integrated Circuits
Kim, Tak-Yeong;Kim, Tae-Hwan;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.29-39,
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| 3 |
Thermal Issues in 3D IC
Sin, In-Seop;Kim, Sang-Min;Baek, Seung-Hun;Seo, Mun-Jun;Yu, Ri-Eun;Sin, Yeong-Su;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.40-50,
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| 4 |
3차원 적층 패키징 기술 동향
Choe, Gwang-Seong;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.51-60,
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| 5 |
3D IC에서의 인터페이스 기술
Kim, So-Yeong;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.61-69,
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| 6 |
3차원 칩 집적기술의 산업적 전망
Jang, Myeong-Su;Ryu, Seong-Min;Do, Gyeong-Tae;Jin, U-Jin;Jeong, Geun-Yeong;Jo, Gwang-Du;Jeon, Jong-Seong;Choe, Gyu-Myeong;
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The Institute of Electronics and Information Engineers
, v.36, no.9, pp.70-81,
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