We have measured the Hall resistivity (${\rho}_{xy}$) and the longitudinal resistivity (${\rho}_{xy}$) on superconducting $MgB_2$ thin films in extended fields up to 18 T. We found a universal scaling behavior between the Hall resistivity and the longitudinal resistivity, which is independent of the temperature and the magnetic field. At a wide magnetic field region from 1 to 18T, a universal power law of ${\beta}=2.0{\pm}0.1$ in a scaling relation, ${\rho}_{xy}={A{\rho}_{xx}}^{\beta}$, was observed in c-axis-oriented $MgB_2$ thin films. These results can be well interpreted by using recent models.

The Arithmetic Logic Unit (ALU) is a core element of a computer processor that performs arithmetic and logic operations on the operands in computer instruction words. We have developed and tested an RSFQ multi-bit ALU constructed with half adder unit cells. To reduce the complexity of the ALU, We used half adder unit cells. The unit cells were constructed of one half adder and three de switches. The timing problem in the complex circuits has been a very important issue. We have calculated the delay time of all components in the circuit by using Josephson circuit simulation tools of XIC, $WRspice^{TM}$, and Julia. To make the circuit work faster, we used a forward clocking scheme. This required a careful design of timing between clock and data pulses in ALU. The designed ALU had limited operation functions of OR, AND, XOR, and ADD. It had a pipeline structure. The fabricated 1-bit, 2-bit, and 4-bit ALU circuits were tested at a few kilo-hertz clock frequency as well as a few tens giga-hertz clock frequency, respectively. For high-speed tests, we used an eye-diagram technique. Our 4-bit ALU operated correctly at up to 5 GHz clock frequency.

High critical current density, high n value, multiple faults endurances, and fast recovery characteristics of YBCO thin films are very attractive characteristics for developing resistive type superconducting fault current limiters. But due to the limited current and voltage ratings of one YBCO module, it is needed to construct series and parallel module connections for high capacity electric networks. Especially for distribution network, more than 30 units should be connected in series to meet voltage level. So in order to construct distribution-level superconducting fault current limiter, simultaneous quench in one YBCO thin films should be realized, and furthermore, quench should be occurred in all fault current limiting units equally to avoid local heating and failures. In this paper, we proposed optimum design of YBCO thin films for fault current limiting module and technical method using shunt resistor to achieve simultaneous quench between multi current limiting units. From the analytical and the experimental results, optimal current path and thickness of shunt material was determined for YBCO thin films and shunt resistor between modules was developed. Finally, 14 kV one phase resistive fault current limiter using multi YBCO thin films was constructed and it was possible to get satisfactory test results.

We comparatively studied the epitaxial growth conditions of $CeO_2$ and $Y_2O_3$ thin buffers on textured Ni tapes using rf magnetron sputtering and investigated the feasibility of getting a single mixture layer or sequential layers of $CeO_2$ and $Y_2O_3$ for more simplified buffer architecture. All the buffer layers were first deposited using the reducing gas of $Ar/4%H_2$ and subsequently the reactive gas mixture of Ar and $O_2$, The crystalline quality and biaxial alignment of the films were investigated using X-ray diffraction techniques (${\Theta}-2{\Theta},\;{\phi}\;and\;{\omega}\;scans$, pole figures). The $CeO_2$ single layer exhibited well developed (200) epitaxial growth at the condition of $10%\;O_2$ below an $450^{\circ}C$, but the epitaxial property was decreased with increasing the layer thickness. $Y_2O_3$ seldom showed optimum condition for (400) epitaxial growth. The sequential architecture of $CeO_2/Y_2O_3/CeO_2$ having good epitaxial property was achieved by sputtering at a temperature of $700^{\circ}C$ on the initial $CeO_2$ bottom layer sputtered at $400^{\circ}C$. Cracking of the sputtered buffer layers was seldom observed except the double layer structure of $CeO_2/Y_2O_3$.

Buffer layers such as $CeO_2\;and\;Yb_2O_3$ films for YBCO coated conductors were deposited on (100) $SrTiO_3$ single crystals and (100) textured Ni substrates by a metal organic chemical vapor deposition (MOCVD) system of the hot-wall type. The substrates were moved with the velocity of 40 cm/hr. Source flow rate, $Ar/O_2$ flow rate and deposition temperature were main processing variables. The degree of film epitaxy and surface morphology were investigated using XRD and SEM, respectively. On a STO substrate, the $CeO_2$ film was well grown epitaxially above the deposition temperature of $450^{\circ}C$. However, on a Ni substrate, the XRD showed NiO (111) and (200) peaks due to Ni oxidation as well as (111) and (200) film growth. For the films deposited with $O_2$ gas as oxygen source, it was found that the NiO film was formed at the interface between the buffer layer and the Ni substrate. The NiO layer interrupts the epitaxial growth of the buffer layer. It seems that the epitaxial growth of the buffer layer on Ni metal substrates using $O_2$ gas is difficult. We are considering a new method avoiding Ni oxidation with $H_2O$ vapor instead of $O_2$ gas.

We fabricated YBCO coated conductors (CCs) by TFA-MOD process and evaluated microstructure, texture formation, and critical temperature ($T_c$) and current ($I_c$). YBCO precursor solution was synthesized using metal-trifluoroacetates and dip coated on $LaAlO_3$(LAO) substrate. The phase formation and microstructure was characterized by X-ray diffraction and scanning electron microscopy (SEM) and the degree of texture was evaluated by pole-figure analysis. The CC was heat-treated in various calcining temperatures ($370^{\circ}C-460^{\circ}C$) and firing temperatures ($750^{\circ}C-800^{\circ}C$). As fired at $775^{\circ}C$ for 4h, the CC had the highest $T_c$ of 89.5 K and $I_c$ of 40 A/cm-width ($J_c=2.0\;MA/cm^2$). Microstructural observation indicated that the YBCO film was dense and homogeneous and had a strong cube texture without formation of second phase and its in-plane full-width at half-maxima; $5.2^{\circ}$ under optimum condition.

We fabricated the YBCO films on single crystal $LaAlO_3$ substrates via a metal organic deposition (MOD) process. In the process, $Y_2Ba_1Cu_1O_x$ and $Ba_3Cu_5O_8$ powders were dissolved in trifluoroacetic acid (TFA) followed by calcining and firing heat treatments. To evaluate the effects of the firing temperature on YBCO phase formation and critical properties, the films were fired at $750^{\circ}C,\;775^{\circ}C\;and\;800^{\circ}C$ after calcining at $430^{\cric}C$. Microstructure observation indicated that a crack-free surface formed and a strong biaxial texture was developed. The FWHM of out-of-plane texture was measured to be in the range of $4.3^{\cric}-7.0^{\circ}$ for all the films. When the YBCO film was fired at $775^{\cric}C$, it had the highest critical properties: 88.5 K of critical temperature and 16 A/cm-width of critical current ($1MA/cm^2$ as critical current density). On the other hand, those properties were degraded as firing at $750^{\circ}C\;and\;800^{\circ}C$. It is considered that the improved critical values are partly owing to dense and homogeneous microstructure, strong texture, and high oxygen content.

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

New precursor solution with dichloroacetic acid (DCA) was developed for fabricating high $J_c$ REBCO film. DCA based-precursor solution was coated on $LaAlO_3$(001) substrate by dip coating method. Processing parameters such as oxygen partial pressure, water vapor, ramping rate and pyrolysis temperature were controlled in order to obtain a good epitaxial film. The film with thickness of 0.5 micrometer was obtained by single coating and no crack was observed at calcined films. Oxygen partial pressure was controlled in the range of $100{\sim}1,000$ ppm and conversion heat treatment was carried out at the temperature range of $705-765^{\circ}C$. A critical transition temperature ($T_c$) of 90 K and a critical transport current density ($J_c$) of $>0.5\;MA/cm^2$ (77 K and self-field) were obtained for the GdBCO film. It is thought that fluorine-free MOD solution using DCA is promising precursor solution for fabricating high quality REBCO films.

Superconducting YBCO films were successfully fabricated by MOD process using chemically modified precursor solution. In this study, a chemically modified precursor solution for MOD processing was synthesized using metal-organic salts and organic additives. It was shown that crack-free and uniform precursor films were formed after calcination in humidified Oxygen atmosphere. Less than 3 hours are required to finish the calcination process. XRD measurement shows that $BaF_2,\;CuO,\;Y_2O_3$ are major constituent of precursor films. Furthermore, YBCO films without any secondary phases were successfully fabricated after annealing in wet $Ar/O_2$ atmosphere. The YBCO film prepared on a $LaAlO_3$ single crystal substrate ($10mm{\times}10mm$) gives transport $I_c$ of 10A at 77K. This chemical modification approach is a possible candidate for improving MOD-processing of YBCO coated conductor.

We have proposed a 3 phase, 100 MVA, 154 kV class HTS transformer substituting for a 60 MVA conventional transformer. The power transformer of 154 kV class has a tertiary winding besides primary and secondary windings. So the HTS transformer should have the 3rd superconducting winding. In this paper, we designed conceptually the structure of the superconducting windings of a single phase 33 MVA transformer. The electrical characteristics of the HTS transformer such as % impedance and AC loss vary with the arrangement of the windings and gaps between windings. We analyzed the effects of the winding parameters, evaluated the cost of each design, and proposed a suitable HTS transformer model for future power distribution system.

Coated conductors suitable for the fabrication of persistent mode high $T_c$ magnets are suggested and the fabrication method of persistent mode magnets using coated conductor are demonstrated. Persistent current was observed in a small piece of coated conductor. Closed loop of coated conductor with a diameter of around 1 em was successfully prepared and was cooled with a magnetic field of about 500 Gauss in order to induce supercurrent. Coated conductor with a $I_c$ of 100 A/cm-width was used for the preparation of closed loop of coated conductor. Persistent current was confirmed by measuring the magnetic field generated from closed loop of coated conductor by using Gauss meter. Magnetic field of 4.4 Gauss was detected from the supercurrent of closed loop of coated conductor. It shows that superconducting joint of coated conductor is not a prerequisite for the construction of persistent mode magnets. It is thought that this work opens the possibility to use coated conductor for the construction of persistent mode high $T_c$ magnets for MRI, NMR and magnetic separation applications.

For the practical application on SCFCL, Bi2212 tubes were fabricated by Centrifugal Forming Process (CFP) in terms of many different processing parameters. Typical sizes of tubes were 60, 150 mm in length and 2.5, 3.5, 4.8 mm in thickness. Initially powder was melted by induction heating. The optimum range of melting temperatures and preheating temperature were $1100^{\circ}C$ and $500^{\circ}C$ for 30min respectively. The nominal mold rotating speed was around 1000 RPM. A tube was annealed at $840^{\circ}C$ for 80 hours in oxygen atmosphere. The tube of 50mm x 70mm x 2.5mm, rotated with 1000 RPM showed $I_c=890\;A\;and\;T_c=80$. It was found that the tube processed with faster rate of mold rotation speed, thinner tube thickness and shorter tube length shows better electric characteristics as compared with the tube normally processed. In order to study the uniformity heat and fluid flow analysis tool was adopted along tube.

As a material for SFCL(Superconducting Fault Current Limiter), BSCCO tube with metal stabilizer is a promising candidate, assuring the stability and large power capacity, For the application, the proper soldering technique, which overcome the difficulties of the joining between BSCCO and metal stabilizer, is required. In this study, after soldering In-Bi solder and In-Sn solder with BSCCO superconductor, welding properties between BSCCO and solders were investigated. Because ceramic materials is difficult to weld, Ag electro-plating on BSCCO 2212 is used for intermetallic layer. To find out the best welding condition for superconductor, soldering is tested in the maximum temperature from $155^{\circ}C\;to\;165^{\circ}C$ in the reflow oven. By investigating the composition and thickness of IMC (lntermetallic Compound) created in the reaction of Ag with solder, we analyzed the welding properties of High-Tc superconductor from a micro point of view.