International Journal of Internet, Broadcasting and Communication

  • 제16권4호
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  • Pages.265-272
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  • 2024
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  • 2288-4920(pISSN)
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  • 2288-4939(eISSN)
한국인터넷방송통신학회 (The Institute of Internet, Broadcasting and Communication)
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Study on Nondestructive Analysis Techniques for Semiconductor Chips in Communication Device Development

  • Yongho Choi (Department of Semiconductor Engineering, Jungwon University)
  • 투고 : 2024.10.03
  • 심사 : 2024.10.15
  • 발행 : 2024.11.30
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초록

Semiconductors are crucial components in communication technology, playing important roles in various communication systems. They are essential for signal processing, data transmission, and ensuring the stability of communication networks. In particular, high-performance semiconductor chipsets and processors enable ultra-fast data transmission and ultra-low latency in communication technology. For example, semiconductors are indispensable in smartphones, wireless networks, and satellite communication systems. For semiconductor packaging products, nondestructive internal analysis for defect analysis and process improvement without causing deformation of system packaging is an important part of the product development process. In this study, nondestructive analysis techniques using X-ray equipment are discussed. The results of this study can provide fast and accurate nondestructive analysis of semiconductor packaging products and can play a significant role in supporting the growth of the communication industry.

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과제정보

This research was supported by "Regional Innovation Strategy (RIS)" through the National Research Foundation of Korea(NRF) funded by the Ministry of Education(MOE) (2021RIS-001)

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