반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

Numerical Analysis of the Thermodynamic Stability of Aqueous Cu-Ni-S-H2O System for the Preparation of Thin Copper-Nickel Multi-nano-Layers by Using Pulse Electro-forming

  • Sang Bum, Lee (Department of Software, Dankook University) ;
  • Yong Choi (Department of Material, Dankook Univerisy )
  • 투고 : 2024.08.07
  • 심사 : 2024.09.12
  • 발행 : 2024.09.30
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초록

Thermodynamic solution stability of aqueous copper-nickel-sulfur system was numerically analyzed to produce thin copper-nickel nano-multi-layers by pulse electro-forming. The main program for numerical analysis was written by C# language, which was composed of the data input, numerical calculation, decision and plotting sub-programs. From the thermodynamic data of 32-feasible phases of the Cu-Ni-S-H2O system, the phase stability diagram of the Cu-Ni-S-H2O system was constructed. It revealed the electro-forming condition of the copper and the nickel was VSHE<0.35 for copper deposition, VSHE<-0.24 for nickel deposition, pH=1.0 and 25℃ in the sulfide bath. The coppernickel multi-layers was well produced by electro-forming in the sulfide bath with two-wave pulse voltages of - 0.2VSHE, -0.5 mA/cm2, and 25 seconds for copper deposition and -1.7 VSHE, -50 mA/cm2 and 80 seconds for nickel deposition, at pH=1.0 and 25℃. From TEM and EDX analysis the Cu-Ni multi-layers with about 5 ㎛ thick had the copper-rich phase of about 20 nm in thick and the nickel rich phase of about 25 nm in thick, respectively.

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참고문헌

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