Textile Science and Engineering (한국섬유공학회지)

The Korean Fiber Society (한국섬유공학회)
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Compressive Properties of 3D Printed Foot Correction Pad Manufactured Using Thermoplastic Polyurethane

3D 프린팅 열가소성 폴리우레탄 발 교정 패드의 압축특성

  • Imjoo Jung (Department of Fashion and Textiles, Dong-A University) ;
  • Ye-eun Park (Department of Fashion and Textiles, Dong-A University) ;
  • Jing Li (Department of Fashion and Textiles, Dong-A University) ;
  • Sunhee Lee (Department of Fashion and Textiles, Dong-A University)
  • 정임주 (동아대학교 의상섬유학과) ;
  • 박예은 (동아대학교 의상섬유학과) ;
  • 이정 (동아대학교 의상섬유학과) ;
  • 이선희 (동아대학교 의상섬유학과)
  • Received : 2024.08.05
  • Accepted : 2024.08.24
  • Published : 2024.08.31
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Abstract

Foot correction pads should distribute pressure on the foot to relieve pain, requiring suitable materials or structures. This study involved creating 3D models of eight types of foot correction pads based on wool felt products and manufacturing them using TPU through FFF 3D printing. The process included analyzing wool felt pads and manufacturing 3D-printed TPU pads, evaluating their size, printing time, and various design features. The study compared the weight and compressive properties of TPU metatarsal pads with wool pads. The weight analysis revealed that TPU pads were approximately 1.2 times heavier than wool pads due to their higher density and durability. Despite the added weight, TPU pads offered improved durability and better support characteristics. Compressive tests showed that TPU pads had a higher initial compressive modulus compared to wool pads, indicating better support when attached to the foot. Additionally, TPU pads exhibited superior compressive strength and resilience. Thus, 3D-printed TPU foot correction pads demonstrated better performance than wool pads, with higher initial compressive modulus and resilience, offering superior shock absorption and support. They are expected to have a longer lifespan than wool pads, making them a promising material for foot support applications.

Keywords

Acknowledgement

이 성과는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임(RS-2023-00272281).

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