과제정보
본 논문은 산업통상자원부의 재원으로 한국에너지기술평가원(KETEP)의 지원을 받아 연구되었으며 이에 감사드립니다(No. 20229A10100040).
참고문헌
- Forti, V., Balde, C. P., Kuehr, R., et al., 2020 : The global E-Waste Monitor 2020, pp.13-23, UNU/UNITAR SCYCLE, ITU, ISWA, Bonn/Geneva/Rotterdam.
- Nagarajan, N., Panchatcharam, P., 2023 : Cost-effective and eco-friendly copper recovery from waste printed circuit boards using organic chemical leaching, Heliyon, 9(3), e13806.
- Golzary, A., Abdoli, A. M., 2020 : Recycling of copper from waste printed circuit boards by modified supercritical carbon dioxide combined with supercritical water pretreatment, Journal of CO2 Utilization, 41, 101265.
- Huang, K., Guo, J., Xu, Z., 2009 : Recycling of waste printed circuit boards: A review of current technologies and treatment status in China, Journal of Hazardous Materials, 164, pp.399-408. https://doi.org/10.1016/j.jhazmat.2008.08.051
- Hall, W. J., Williams, P. T., 2007 : Separation and recovery of materials from scrap printed circuit boards, Resource, Conservation and Recycling, 5(3), pp.691-709. https://doi.org/10.1016/j.resconrec.2006.11.010
- Cui, J. and Zhang, L., 2008 : Metallurgical recovery of metals from electronic waste: A review, Journal of Hazardous Materials, 158(2-3), pp.228-256. https://doi.org/10.1016/j.jhazmat.2008.02.001
- Marco, I. de., Caballero, B. M., Chomon, M. J., et al., 2008 : Pyrolysis of electrical and electronic wastes, Journal of Analytical and Applied Pyrolysis, 82(2), pp.179-183. https://doi.org/10.1016/j.jaap.2008.03.011
- Guo, J., Rao, Q., Xu, J., 2008 : Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound, Journal of Hazardous Materials, 153, pp.728-734. https://doi.org/10.1016/j.jhazmat.2007.09.029
- He, W., Li, G., Ma, X., et al., 2006 : WEEE recovery strategies and the WEEE treatment status in China, Journal of Hazardous Materials, 136(3), pp.502-512. https://doi.org/10.1016/j.jhazmat.2006.04.060
- Petter, P. M. H., Veit, H. M., Bernardes, A. M., 2014 : Evaluation of gold and silver leaching from printed circuit board of cellphones, Waste Management, 34(2), pp.475-482. https://doi.org/10.1016/j.wasman.2013.10.032
- An, H., Kang, L., Lee, C. G., 2017 : Analysis of Commercial Recycling Technology and Research Trend of Printed Circuit Boards in Korea, Journal of the Korean Institute of Resources Recycling, 26(4), pp.9-18. https://doi.org/10.7844/KIRR.2017.26.4.9
- Duan, C. L., Diao, Z. J., Zhao, Y. M., et al., 2015 : Liberation of valuable materials in waste printed circuit boards by high-voltage electrical pulses, Minerals Engineering, 70, pp.170-177. https://doi.org/10.1016/j.mineng.2014.09.018
- Kim, B., Park, S., Kim, B., et al., 2018 : Physical Property Changes of Wasted Printed Circuit Board by Heat Treatment, Journal of the Korean Institute of Resources Recycling, 27(1), pp.55-63. https://doi.org/10.7844/KIRR.2018.27.1.55
- Hou, P., Zhao, A., Wu, W., et al., 2018 : Failure mechanism of glass-fiber reinforced laminates influenced by the copper film in three-point bending, International Journal of Adhesion and Adhesives, 84, pp.368-377. https://doi.org/10.1016/j.ijadhadh.2018.05.006
- Hong, S. H., 2011 : Feasibility of Copper Powder Fabrication by Ball Milling of Copper Chip Scrap Occurred During Cutting Process of Copper Pipe, Journal of the Korean Institute of Resources Recycling, 20(6), pp.37-42. https://doi.org/10.7844/KIRR.2011.20.6.037