Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Nondestructive Quantification of Corrosion in Cu Interconnects Using Smith Charts

스미스 차트를 이용한 구리 인터커텍트의 비파괴적 부식도 평가

  • Minkyu Kang (Department of Mechanical Engineering, The University of Suwon) ;
  • Namgyeong Kim (Department of Mechanical Engineering, The University of Suwon) ;
  • Hyunwoo Nam (Department of Mechanical Engineering, The University of Suwon) ;
  • Tae Yeob Kang (Department of Mechanical Engineering, The University of Suwon)
  • 강민규 (수원대학교 산업 및 기계공학부 기계공학과) ;
  • 김남경 (수원대학교 산업 및 기계공학부 기계공학과) ;
  • 남현우 (수원대학교 산업 및 기계공학부 기계공학과) ;
  • 강태엽 (수원대학교 산업 및 기계공학부 기계공학과)
  • Received : 2024.06.10
  • Accepted : 2024.06.30
  • Published : 2024.06.30
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Abstract

Corrosion inside electronic packages significantly impacts the system performance and reliability, necessitating non-destructive diagnostic techniques for system health management. This study aims to present a non-destructive method for assessing corrosion in copper interconnects using the Smith chart, a tool that integrates the magnitude and phase of complex impedance for visualization. For the experiment, specimens simulating copper transmission lines were subjected to temperature and humidity cycles according to the MIL-STD-810G standard to induce corrosion. The corrosion level of the specimen was quantitatively assessed and labeled based on color changes in the R channel. S-parameters and Smith charts with progressing corrosion stages showed unique patterns corresponding to five levels of corrosion, confirming the effectiveness of the Smith chart as a tool for corrosion assessment. Furthermore, by employing data augmentation, 4,444 Smith charts representing various corrosion levels were obtained, and artificial intelligence models were trained to output the corrosion stages of copper interconnects based on the input Smith charts. Among image classification-specialized CNN and Transformer models, the ConvNeXt model achieved the highest diagnostic performance with an accuracy of 89.4%. When diagnosing the corrosion using the Smith chart, it is possible to perform a non-destructive evaluation using electronic signals. Additionally, by integrating and visualizing signal magnitude and phase information, it is expected to perform an intuitive and noise-robust diagnosis.

전자패키지 내부의 부식이 시스템 성능 및 신뢰성에 큰 영향을 미치고 있어, 시스템 건전성 관리를 위해 부식에 대한 비파괴적 진단 기법의 필요성이 커지고 있다. 본 연구에서는 복소 임피던스의 크기와 위상을 통합적으로 시각화하는 도구인 스미스 차트를 활용하여, 구리 인터커넥트의 부식을 비파괴적으로 평가하는 방법을 제시하고자 한다. 실험을 위해 구리 전송선을 모사한 시편을 제작하고, MIL-STD-810G 기준 온습도 사이클에 노출시켜 시편에 부식을 인가하였다. R 채널 기반 색변화로 시편의 부식도를 정량적으로 평가하고 레이블링 하였다. 부식의 성장에 따라 시편의 S-파라미터와 스미스 차트를 측정한 결과, 5 단계의 부식도에 따라 유의미한 패턴의 변화가 관찰되어, 스미스 차트가 부식도 평가에 효과적인 도구임을 확인하였다. 더 나아가 데이터 증강을 통해 다양한 부식도를 갖는 4,444개의 스미스 차트를 확보하여, 스미스 차트를 입력 받아 구리 인터커넥트의 부식 단계를 출력하는 인공지능 모델을 학습시켰다. 이미지 분류에 특화된 CNN 및 Transfomrer 모델을 적용한 결과, ConvNeXt 모델이 정확도 89.4%로 가장 높은 부식 진단 성능을 보였다. 스미스 차트를 이용하여 전자패키지 내부 부식을 진단할 경우, 전자신호를 이용하는 비파괴적 평가를 수행할 수 있다. 또한. 신호 크기와 위상 정보를 통합적으로 시각화 하여 직관적이며 노이즈에 강건한 진단이 가능할 것으로 기대한다.

Keywords

Acknowledgement

이 연구는 2024 년도 수원대학교 학술진흥연구비 지원으로 수행되었습니다.

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