Acknowledgement
이 연구는 2024년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원에 의한 연구임(과제번호: 20018017).
References
- G.A. Slack, "Nonmetallic crystals with high thermal conductivity", J. Phys. Chem. Solids 34 (1973) 321.
- L.M. Sheppard, "Aluminum nitride: a versatile but challenging material", Am. Ceram. Soc. Bull. 69 (1990) 1801.
- J.F. Daviet, I. Peccoud and F. Mondon, "Electrostatic clamping applied to semiconductor plasma processing I. theoretical modeling", J. Electrochem. Soc. 140 (1993) 3245.
- Y. Baik and R.A. Drew, "Aluminum nitride: processing and applications", Key Eng. Mater. 122-124 (1996) 553.
- K. Watari, H. J. Hwang, M. Toriyama and S. Kanzaki, "Effective sintering aids for low-temperature sintering of AlN ceramics", J. Mater. Res. 14 (1999) 1409.
- A.V. Virkar, T.B. Jackson and R.A. Cutler, "Thermodynamic and kinetic effects of oxygen removal on the thermal conductivity of aluminum nitride", J. Am. Ceram. Soc. 72 (1989) 2031.
- K. Komeya, H. Inoue and A. Tsuge, "Role of Y2O3 and SiO2 additions in sintering of AlN", J. Am. Ceram. Soc. 54 (1974) 411.
- H.M. Lee, K. Bharathi and D.K. Kim, "Processing and characterization of aluminum nitride ceramics for high thermal conductivity", Adv. Eng. Mater. 16 (2014) 655.
- P. Motamedi and K. Cadien, "XPS analysis of AlN thin films deposited by plasma enhanced atomic layer deposition", Appl. Surf. Sci. 315 (2014) 104.
- J.W. Lee, W.J. Lee and S.M. Lee, "Electrical behavior of aluminum nitride ceramics sintered with yttrium oxide and titanium oxide", J. Korean. Ceram. Soc. 53 (2016) 635.