한국섬유공학회지 (Textile Science and Engineering)

  • 제61권2호
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  • Pages.70-80
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  • 2024
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  • 1225-1089(pISSN)
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  • 2288-6419(eISSN)
한국섬유공학회 (The Korean Fiber Society)
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페닐렌 디아민의 아렌 대체 패턴에 따른 에폭시 수지의 경화 거동과 열 및 기계적 특성 연구

Cure Behavior, Thermal and Mechanical Properties of Epoxy Resins with Arene Substitution Patterns of Phenylenediamines

  • 박건환 (경북대학교 섬유시스템공학과) ;
  • 권웅 (경북대학교 섬유시스템공학과) ;
  • 천지연 (경북대학교 섬유시스템공학과) ;
  • 정희제 (울산과학기술원 신소재공학과) ;
  • 임지훈 (울산과학기술원 신소재공학과) ;
  • 원종성 (국방과학연구소 소재에너지센터) ;
  • 이만영 (국방과학연구소 소재에너지센터) ;
  • 이승걸 (울산과학기술원 신소재공학과) ;
  • 정의경 (경북대학교 섬유시스템공학과)
  • Gun Hwan Park (Department of Textile System Engineering, Kyungpook National University) ;
  • Woong Kwon (Department of Textile System Engineering, Kyungpook National University) ;
  • Jiyeon Cheon (Department of Textile System Engineering, Kyungpook National University) ;
  • Hei Je Jeong (Material Science Engineering, Ulsan National Institute of Science and Technology) ;
  • Ji Hoon Lim (Material Science Engineering, Ulsan National Institute of Science and Technology) ;
  • Jong Sung Won (Materials & Energy Technology Center, Agency for Defense Development) ;
  • Man Young Lee (Materials & Energy Technology Center, Agency for Defense Development) ;
  • Seung Geol Lee (Material Science Engineering, Ulsan National Institute of Science and Technology) ;
  • Euigyung Jeong (Department of Textile System Engineering, Kyungpook National University)
  • 투고 : 2024.03.30
  • 심사 : 2024.04.17
  • 발행 : 2024.04.30
⟨ 이전 논문 다음 논문 ⟩

초록

To study the effect of arene substitution patterns of phenylenediamines, as curing agents, on curing behaviors, thermal and mechanical properties of epoxy resins, DGEBF(Diglycidyl ether of bisphenol F) and o, m, p-phenylenediamine(PDA) were selected. The cure kinetics of epoxy mixtures were analyzed under both dynamic and isothermal conditions using differential scanning calorimetry(DSC). The activation energy and curing initiation temperature were found to be lowest with p-PDA and highest with o-PDA and it resulted that the degree of cure and curing rate were highest and fastest with p-PDA and lowest with o-PDA. Tg and thermal stability of the epoxy samples were better with o-PDA and m-PDA than p-PDA. Tensile strength and fracture toughness were highest with m-PDA and lowest with p-PDA. These results indicated that m-PDA could be the best curing agent of isomeric PDAs. And mechanical properties of the epoxy resin could be different only by the isomeric structures of curing agents.

키워드

과제정보

본 연구는 대한민국 정부(산업통상자원부 및 방위사업청) 재원으로 민군협력진흥원에서 수행하는 민군기술협력사업의 연구비 지원으로 수행되었습니다(과제번호 22-CM-19).

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