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반도체 FAB의 자동화 물류 시스템을 위한 다중해상도 모델링 방법

Multi-resolution Modeling Method for Semiconductor FAB Automated Material Handling System

  • 투고 : 2023.02.27
  • 심사 : 2023.03.31
  • 발행 : 2023.06.30

초록

본 연구에서는 반도체 FAB의 자동화 물류 시스템에 대한 다중해상도 모델링 방법을 제안한다. 이산사건 시뮬레이션은 반도체 산업 분야에서 중요한 도구로 활용되고 있지만, 반도체 생산 시스템과 물류 시스템을 함께 모델링하면 시뮬레이션 속도가 느려지는 문제점이 있다. 본 연구에서는 이러한 문제를 극복하기 위해, 고해상도 모델과 저해상도 모델을 동시에 사용하여 FAB의 자동화 물류 시스템에 대한 모델을 생성하는 방법을 제안한다. 고해상도 모델에서 추출된 FAB의 물류 시스템 특성을 저해상도 모델에 상속함으로써, 높은 시뮬레이션 속도와 높은 정합성을 갖는 FAB의 자동화 물류 시스템 모델을 획득할 수 있다. 본 연구에서는 SMT2020, SMAT2022 테스트배드를 활용한 시뮬레이션 사례 연구를 통해 제안된 방법의 효율성을 입증하였다. 이를 통해 제안된 다중해상도 모델링 방법이 반도체 FAB 시뮬레이션의 효율성과 정확성을 향상할 수 있는 중요한 기술적 기여할 것으로 기대된다.

In this study, we propose a multi-resolution modeling method for the automated material handling system in semiconductor FABs. Discrete-event simulation is a crucial tool for experimenting and solving decision-making problems in the semiconductor industry. However, when both the production and logistics systems of semiconductor FABs are modeled together, simulation speed can become slow. To address this issue, we suggest a method that uses high-resolution and low-resolution models simultaneously to create a model of FAB's automated material handling system. By inheriting the logistics system characteristics extracted from the high-resolution model into the low-resolution model, we can obtain an FAB automated material handling system model with high simulation speed and accuracy. We verified the efficiency of our proposed method through simulation case studies using SMT2020 and SMAT2022 testbeds. Our proposed multi-resolution modeling method is expected to make an important technical contribution to improving the efficiency and accuracy of semiconductor FAB simulation.

키워드

과제정보

본 논문은 한국연구재단(NRF-2020R1A2C1004544), 정보통신기획평가원(IITP-2021000292), 그리고 산업통상자원부(RS-2022-00155650)의 지원을 받아 수행한 과제입니다.

참고문헌

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