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알루미늄 위 친환경적 무전해 Ni-P 도금막 형성에 pH와 도금조 온도가 미치는 영향

Effects of pH and Plating Bath Temperature on Formation of Eco-Friendly Electroless Ni-P Plating Film on Aluminum

  • 지현배 (한밭대학교 정보통신공학과) ;
  • 빈정수 (한밭대학교 정보통신공학과) ;
  • 이연승 (한밭대학교 정보통신공학과) ;
  • 나사균 (한밭대학교 신소재공학과)
  • Gee, Hyun-Bae (Department of Information and Communication Engineering, Hanbat National University) ;
  • Bin, Jung-Su (Department of Information and Communication Engineering, Hanbat National University) ;
  • Lee, Youn-Seoung (Department of Information and Communication Engineering, Hanbat National University) ;
  • Rha, Sa-Kyun (Department of Advanced Materials Engineering, Hanbat National University)
  • 투고 : 2022.06.27
  • 심사 : 2022.09.01
  • 발행 : 2022.09.27

초록

The overall process, from the pre-treatment of aluminum substrates to the eco-friendly neutral electroless Ni-P plating process, was observed, compared, and analysed. To remove the surface oxide layer on the aluminum substrate and aid Ni-P plating, a zincation process was carried out. After the second zincation treatment, it was confirmed that a mostly uniform Zn layer was formed and the surface oxide of aluminum was also removed. The Ni-P electroless plating films were formed on the secondary zincated aluminum substrate using electroless plating solutions of pH 4.5 and neutral pH 7.0, respectively, while changing the plating bath temperature. When a neutral pH7.0 electroless solution was used, the Ni-P plating layer was uniformly formed even at the plating bath temperature of 50 ℃, and the plating speed was remarkably increased as the bath temperature was increased. On the other hand, when a pH 4.5 Ni-P electroless solution was used, a Ni-P plating film was not formed at a plating bath temperature of 50 ℃, and the plating speed was very slow compared to pH 7.0, although plating speed increased with increasing bath temperature. In the P contents, the P concentration of the neutral pH 7.0 Ni-P electroless plating layer was reduced by ~ 42.3 % compared to pH 4.5. Structurally, all of the Ni-P electroless plating layers formed in the pH 4.5 solution and the neutral (pH 7.0) solution had an amorphous crystal structure, as a Ni-P compound, regardless of the plating bath temperature.

키워드

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