마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제29권2호
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  • Pages.11-18
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  • 2022
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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갈륨 및 갈륨 합금을 이용한 저온접합 기술 동향

Trends of Low-temperature Bonding Technologies using Gallium and Gallium Alloys

  • 홍태영 (조선대학교 용접.접합과학공학과) ;
  • 심호률 (조선대학교 용접.접합과학공학과) ;
  • 손윤철 (조선대학교 용접.접합과학공학과)
  • Hong, Teayeong (Dept. of Welding & Joining Science Engineering, Chosun University) ;
  • Shim, Horyul (Dept. of Welding & Joining Science Engineering, Chosun University) ;
  • Sohn, Yoonchul (Dept. of Welding & Joining Science Engineering, Chosun University)
  • 투고 : 2022.06.10
  • 심사 : 2022.06.29
  • 발행 : 2022.06.30
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⟨ 이전 논문 다음 논문 ⟩

초록

최근 세계적으로 유연 전자소자 관련 기술들이 주목을 받으면서 유연소자 제작 과정에서의 성형성 및 굽힘 상태에서의 성능과 내구성 등의 문제점을 개선하기 위하여 액체 금속을 사용한 배선·접합 기술들의 개발이 요구되고 있다. 이러한 요구에 부응하여 독성이 없으면서 낮은 점도와 우수한 전기전도도를 가지는 갈륨 및 갈륨계 합금 (공정 갈륨-인듐 및 공정 갈륨-인듐-주석 등)의 액체금속을 저온 접합소재로 이용하려는 다양한 연구들이 이루어지고 있다. 본 논문에서는 갈륨 및 갈륨계 합금을 이용한 저온접합 기술의 최신 연구동향을 정리하여 소개하고자 한다. 이러한 기술들은 향후 유연 전자소자의 제조 및 전자패키지에서의 저온접합 등의 분야에서 실용화를 위한 중요한 기반기술이 될 것으로 예상된다.

Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and durability in the bending state. In response to these needs, various studies are being conducted to use gallium and gallium-based alloys (eutectic Ga-In and eutectic Ga-In-Sn, etc.) liquid metals, with low viscosity and excellent electrical conductivity without toxicity, as low-temperature bonding materials. In this paper, the latest research trends of low-temperature bonding technology using gallium and gallium-based alloys are summarized and introduced. These technologies are expected to become important base technologies for practical use in the fields of manufacturing flexible electronic devices and low-temperature bonding in microelectronic packages in the future.

키워드

과제정보

본 연구는 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행되었습니다(No. 2020R1F1A1065957).

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