과제정보
이 논문은 안동대학교 기본연구지원사업에 의하여 연구되었음.
참고문헌
- B. I. Noh, S. B. Jung, "Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate", J. Electron. Mater., 38(1), 46-53 (2009). https://doi.org/10.1007/s11664-008-0543-z
- J. Jang, T. Earmme, "Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters", Polymer, 42(7), 2871-2876 (2001). https://doi.org/10.1016/S0032-3861(00)00701-1
- K. W. Lee, A. Viehbeck, "Wet-process surface modification of dielectric polymers: Adhesion enhancement and metallization", IBM J. Res. Dev., 38(4), 457-474 (1994). https://doi.org/10.1147/rd.384.0457
- S. C. Park, Y. B. Park, "Effect of CF4 plasma treatment on the interfacial fracture energy between inkjet-printed Ag and flexible polyimide films", Surf. Coat. Technol., 205(2), 423-429 (2010). https://doi.org/10.1016/j.surfcoat.2010.07.005
- S. C. Park, K. J. Min, K. H. Lee, Y. Jeong, and Y. B. Park, "Effects of Temperature and Humidity Treatment Conditions on the Interfacial Adhesion Energy between the Electroless-Plated Ni and Polyimide", Jpn. J. Appl. Phys., 49(851), 08JK01 (2010). https://doi.org/10.1143/JJAP.49.08JK01
- S. C. Park, Y. B. Park, "Ag Pore Effect on the Interfacial Debonding Energy of an Inkjet-Printed Ag Film on Polyimide", J. Kor. Phys. Soc., 54(3), 1288-1292 (2009). https://doi.org/10.3938/jkps.54.1288
- S. C. Park, S. H. Cho, H. C. Jung, J. W. Jung, and Y. B. Park, "A study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment", Kor. J. Mater. Res., 17(4), 215-221 (2007). https://doi.org/10.3740/MRSK.2007.17.4.215
- Y. B. Park, I. S. Park, and J. Yu, "Interfacial Fracture Energy in the Cu/Cr/polyimide system", J. Kor. Inst. Met & Mater., 37(2), 238-243 (1999).
- Association Connecting Electronics Industries (IPC), "Test Methods Manual", 2.4.9, Bannockburn, US (1998).
- Japan Industrial Standards (JIS), "Test methods for flexible printed wiring boards", Japan (1994).
- American Society for Testing and Materials (ASTM), "Standard Test Method for Peel Resistance of Adhesives (T-Peel Test)", West Conshohocken, PA (2001).
- American Society for Testing and Materials (ASTM), "Standard Test Method for Peel Adhesion of Pressure-Sensitive Tape, West Conshohocken, PA (1999).
- Y. B. Park, I. S. Park, and J. Yu, "Interfacial fracture energy measurements in the Cu/Cr/polyimide system", Mater. Sci. Eng., A266(1-2), 261-266 (1999). https://doi.org/10.1016/S0921-5093(98)01117-4
- Y. B. Park, J. Yu, "Effect of Electroplated Cu Thickness and Polyimide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameter in the Cu/Cr/Polyimide system", Met. Mater. Int., 7(2), 123-131 (2001). https://doi.org/10.1007/BF03026950
- International Electrotechnical Commission (IEC), "Measurement of peel strength for printed conductive layer on flexible substrate by the 90° peel method", Geneva, Switzerland (2021).
- J. Y. Song, J. Yu, "Analysis of the T-peel strength in a Cu/Cr/Polyimide system", Acta Mater., 50(16), 3985-3994 (2002). https://doi.org/10.1016/S1359-6454(02)00197-0
- G. E. Dieter, "Mechanical Metallurgy", 295, McGraw-Hill, New York (1989).
- J. H. An, J. H. Park, and Y. J. Kim, "Test Rate Effect on Tensile Properties of Copper Thin Film", Kor. Soc. Mechanical. Eng., 10, 17-20 (2007).