Elastomers and Composites

The Rubber Society of Korea (한국고무학회)
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Preparation of Adhesion Promoter for Lead Frame Adhesion and Application to Epoxy Composite

  • Kim, Jung Soo (Materials & Component Convergence R&D Department, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Eun-jin (Materials & Component Convergence R&D Department, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Dong Hyun (Materials & Component Convergence R&D Department, Korea Institute of Industrial Technology (KITECH))
  • Received : 2022.05.27
  • Accepted : 2022.06.27
  • Published : 2022.06.30
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Abstract

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

Keywords

Acknowledgement

본 연구는 산업통상자원부 산하 한국산업기술평가관리원이 연구 지원한 소재부품기술개발사업(20014546, 20004044)의 일환으로 수행되었기에 감사드립니다.

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