과제정보
This work was supported by Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE). (P0008458, The Competency Development Program for Industry Specialist.)
참고문헌
- Jo, K., and Hong, S., "Improved Self Plasma-Optical Emission Spectroscopy for In-situ Plasma Process Monitoring", Journal of the Semicon-ductor Technology, Vol. 16, No. 2, pp. 75-78, 2017.
- J. Jang, H.-S. Kim, W. Cho, H. Cho, J. Kim, S. I. Shim, Y. Jang, J.-H. Jeong, B.-K. Son, D. W. Kim, Kihyun, J.-J. Shim, J. S. Lim, K.-H. Kim, S. Y. Yi, J.-Y. Lim, D. Chung, H.-C. Moon, S. Hwang, J.-W. Lee, Y.-H. Son, U.-I. Chung and W.-S. Lee, "Vertical Cell Array using TCAT (Terabit Cell Array Transistor) Technology for Ultra High Density NAND Flash Memory", in IEEE VLSI Technol. Symp., Kyoto, Japan, pp. 192-193, Jun., 2009.
- F. F. Chen and J. P. Chang, Lecture Notes on Principles of Plasma Processing, Kluwer Academic: New York, 2003.
- I. Jolliffe, Principal Component Analysis, New York: Springer-Verlag, 2002.
- S. Kim and H. Yi, "Process Monitoring Device and Semiconductor Processing Apparatus including the Same", U.S. Patent 02222058 A1, 2011.
- J . S. Park, M. S. Thesis, Myongji University, Korea, 2008.
- G. S. Selwyn, AVS monograph series: Optical diagnostic Techniques for Plasma Processing, Ed. Woody Weed, AVS Press, New Work, 1993.
- J. W. Coburn and M. Chen, "Optical Emission Spectroscopy of Reactive Plasmas: A Method for Correlating Emission Intensities to Reactive Particle Density", J. Appl. Phys., Vol. 51, No. 2, pp. 3134-3136, 1980. https://doi.org/10.1063/1.328060
- J. Baliga, "Advanced Process Control: Soon to be a Must", Semiconductor International, Vol. 22, No. 2, pp. 76-88, 1998.
- S. W. Butler, "Process Control in Semiconductor Manufacturing", J. Vac. Sci. Technol., Vol. 13, No. 4, pp. 1917-1923, 1995. https://doi.org/10.1116/1.579680
- J.-H. Park, J.-H. Cho, J.-S. Yoon, and J.-H. Song, "Machine learning prediction of electron density and temperature from optical emission spectroscopy in nitrogen plasma", Coatings, Vol. 11, No. 10, pp. 1221-1223, 2021. https://doi.org/10.3390/coatings11101221
- J. V. Ringwood, S. Lynn, G. Bacelli, B. Ma, E. Ragnoli and S. McLoone, "Estimation and Control in Semiconductor Ethc: Practice and Possibilities", IEEE Trans. on Semi. Manufac., Vol. 23, No. 1, pp.87-98, 2010. https://doi.org/10.1109/TSM.2009.2039250
- M. Nisha, K. J. Saji, R. S. Aijmaha, N. V. Joshy and M. K. Jayaraj, "Characterization of Radio Frequency Plasma using Langmuir Probe and Optical Emission Spectroscopy", J. Appl. Phys., Vol. 99, No. 3, pp. 033304-033307, 2006. https://doi.org/10.1063/1.2171777
- S. -K. S. Fan, C. -Y. Hsu, D. -M. Tsai, F. He and C. -C. Cheng, "Data-Driven Approach for Fault Detection and Diagnostic in Semiconductor Manufacturing", IEEE Trans. Auto. Sci. and Eng., Vol. 17, No. 4, pp. 1925-1936, 2020. https://doi.org/10.1109/tase.2020.2983061
- Y. Park, J. Lee, S. S. Cho, G. Jin, and E. Jung, "Scaling and Reliability of NAND Flash Devices", in Proc. IEEE Int. Reliab. Symp., Waikoloa, Hi, pp. 2E.1.1-2E.1.4, Jun. 2014.
- Y. Kim, J.-G. Yun, S. H. Park, W. Kim, J. Y. Seo, M. Kang, K.-C. Ryoo, J.-H. Oh, J.-H. Lee, H. Shin, and B.-G. Park, "Three-Dimensional NAND Flash Architecture Design Based on Single-Crystalline Stacked Array", IEEE Trans. Electron. Dev., Vol.59, No.1, pp. 35-45, 2012. https://doi.org/10.1109/TED.2011.2170841
- W. Kim, S. Choi, J. Sung, T. Lee, C. Park, H. Ko, J. Jung, I. Yoo, and Y. Park, "Multi-Layered Vertical Gate NAND Flash Overcoming Stacking Limit for Terabit Density Storage", in IEEE VLSI Technol. Symp. Dig., Honolulu, HI, pp. 188-189, Jun. 2009.
- D. C. Brock and G. E. Moore, Understanding Moore's Law, Atlasbooks Dist, San Francisco, 2006.
- H. Rostami, J. Blue, C. Yugma, "Automatic equipment fault fingerprint extraction for the fault diagnostic on the batch process data", Applied Soft Computing, Vol. 68, pp.972-989, 2018. https://doi.org/10.1016/j.asoc.2017.10.029
- B. W. Silverman, "Smoothed Functional Principal Component Analysis by Choice of Norm", Annals of Statistics, Vol. 24, No. 1, 1-24, 1996. https://doi.org/10.1214/aos/1033066196
- E. P. van de Ven, I. -W. Connick, and A. S. Harrus, "Advantages of Dual Frequency PECVD for Deposition of ILD and Passivation Films", in Proc. Int. IEEE VLSI Multilevel Interconnection Conf., Santa Clara, CA, pp. 194-201, 1990.
- Tobias, ReiterXaver, KlemenschitsLado Filipovic "Impact of plasma induced damage on the fabrication of 3D NAND flash memory", Solid-State Electronics 192(2022).
- QiangXu, Jingwen Hou, Mingkai Bai1, Zhiguo Zhao, LeiJin, Zongliang Huo and Chunlong Li, "Pre-metal dielectric PE TEOS oxide pitting in 3D NAND: mechanism and solutions", Semiconductor Science and Technology, Volume 37, 2022 Semicond. Sci. Technol. 37, 025007. https://doi.org/10.1088/1361-6641/ac419e
- Yangyao Dinga, Yichi Zhanga, Ho Yeon Chunga, Panagiotis D. Christofides, "Machine learning-based modeling and operation of plasma-enhanced atomic layer deposition of hafnium oxide thin films", Computers & Chemical Engineering Volume 144, 4 January 2021, 107148. https://doi.org/10.1016/j.compchemeng.2020.107148