Acknowledgement
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (MSIT) (Grant Number: 2019R1A2C1005445).
References
- P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, Damascene copper electroplating for chip interconnections, IBM J. Res. Dev., 42, 567-574 (1998). https://doi.org/10.1147/rd.425.0567
- Y. S. Tan, Characterization of low-k dielectric trench surface cleaning after a fluorocarbon etch, Thin Solid Films, 462-463, 250-256 (2004). https://doi.org/10.1016/j.tsf.2004.05.053
- Y. Wang, S. W. Graham, L. Chan, and S. Loong, Understanding of via-etch-induced polymer formation and its removal, J. Electrochem. Soc., 144, 1522-1528 (1997). https://doi.org/10.1149/1.1837621
- M. Engelhardt, G. Schindler, W. Steinhogel, and G. Steinlesberger, Challenges of interconnection technology till the end of the roadmap and beyond, Microelectron. Eng., 64, 3-10 (2002). https://doi.org/10.1016/S0167-9317(02)00766-9
- S. W. Lee and J. J. Kim, Study on the effects of corrosion inhibitor according to the functional groups for cu chemical mechanical polishing in neutral environment, Korean Chem. Eng. Res., 53, 517-523 (2015). https://doi.org/10.9713/kcer.2015.53.4.517
- C. K. Ko and W. G. Lee, Cleaning behavior of aqueous solution containing amine or carboxylic acid in cu-interconnection process, Korean Chem. Eng. Res., 59, 632-638 (2021). https://doi.org/10.9713/KCER.2021.59.4.632
- C. K. Ko and W. G. Lee, Characteristics of semi-aqueous cleaning solution with carboxylic acid for the removal of copper oxides residues, Korean Chem. Eng. Res., 54, 548-554 (2016). https://doi.org/10.9713/kcer.2016.54.4.548
- C. Yamabe, F. Takeshita, T. Miichi, N. Hayashi, and S. Ihara, Water treatment using discharge on the surface of a bubble in water, Plasma Process. Polym., 2, 246-251 (2005). https://doi.org/10.1002/ppap.200400077
- P. Bruggeman and C. Leys, Non-thermal plasmas in and in contact with liquids, J. Phys. D: Appl. Phys., 42, 053001 (2009). https://doi.org/10.1088/0022-3727/42/5/053001
- K. L. Chavez and D. W. Hess, A novel method of etching copper oxide using acetic acid, J. Electrochem. Soc., 148, G640-G643 (2001). https://doi.org/10.1149/1.1409400
- F. K. Mugwang'A, P. K. Karimi, W. K. Njoroge, and O. Omayio, Optical characterization of copper oxide thin films prepared by reactive dc magnetron sputtering for solar cell applications, Int. J. Thin Film. Sci. Technol., 2, 15-24 (2013).
- N. Venkataraman, A. Muthukumaran, and S. Raghavan, Evaluation of Copper oxide to copper selectivity of chemical systems for BEOL cleaning through electrochemical investigations, Mater. Res. Soc. Symp. Proc., April 9-13, San Francisco, USA (2007).
- A. N. Baga, G. R. Alastair Johnson, N. B. Nazhat, and R. A. Saadalla-Mazhat, A simple spectrophotometric determination of hydrogen peroxide at low concentrations in aqueous solution, Anal. Chim. Acta, 204, 349-353 (1988). https://doi.org/10.1016/S0003-2670(00)86374-6
- J. Macdougall, C. Reid, and L. McGhee, Implications of the selectiveness of cu chelators on Cu0, Cu(I)O and Cu(II)O powders, Solid State Phenomena, 134, 329-332 (2008). https://doi.org/10.4028/www.scientific.net/SSP.134.329
- C. K. Ko and W. G. Lee, Dissolution of copper oxide by the ethanolamine and ammonium fluoride in aqueous solution, Surf. Interface Anal., 42, 1128-1130 (2010). https://doi.org/10.1002/sia.3238