Journal of the Korean Society of Visualization (한국가시화정보학회지)

The Korean Society of Visualization (한국가시화정보학회)
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A Study on Radiation Heat Transfer of Wafer Transfer Module Using Computational Flow Visualization

전산유동가시화를 활용한 웨이퍼 이송장치의 복사열전달에 관한 연구

  • Min Gi, Chu (School of Mechanical Engineering, Sungkyunkwan University) ;
  • Ji Hong, Chung (School of Mechanical Engineering, Sungkyunkwan University) ;
  • Dong Kee, Sohn (School of Mechanical Engineering, Sungkyunkwan University) ;
  • Han Seo, Ko (School of Mechanical Engineering, Sungkyunkwan University)
  • Received : 2022.10.22
  • Accepted : 2022.11.06
  • Published : 2022.11.30
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Abstract

The high heat emitted from the process module and heat jacket may cause errors in semiconductor process equipment. Barriers were designed to reduce the temperature of surface on transfer module. A designed barrier was compared and analyzed by numerical analysis using ANSYS Fluent. The average temperature of barrier and effect of radiation heat transfer were also compared through absorbed radiative heat flux of the barrier. The adoption of the barrier had an effect on the radiative heat transfer reduction of the transfer module rod. The effect of the angles of barrier from 50° to 90° on the heat transfer was investigated using the absorbed radiative heat flux with the average temperature. The angle of barrier of 50° reduced the temperature up to 9.6 %.

Keywords

Acknowledgement

본 연구는 산업통상자원부 한국산업기술평가관리원의 소재부품기술개발사업 지원으로 수행되었습니다. (No. 20010554)

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