Acknowledgement
본 연구는 한국연구재단 기초연구(NRF 2021R1F1A1060048)와 나노소재기술개발사업(No 2021M3H4A3A02098099) 지원을 받아 수행된 연구임.
References
- J. M. Quemper, S. Nicolas, J. P. Gilles, J. P. Grandchamp, A. Bosseboeuf, T. Bourouina, and E. Dufour-Gergam, "Permalloy electroplating through photoresist molds", Sens. Actuators, A, 74(1-3), 1-4 (1999). https://doi.org/10.1016/S0924-4247(98)00323-9
- Y. H. Zhang, G. F. Ding, Y. L. Cai, H. Wang, and B. Cai, "Electroplating of low stress permalloy for MEMS", Mater. Charact., 57(2), 121-126 (2006). https://doi.org/10.1016/j.matchar.2005.12.016
- H. V. Venkatasetty, "Electrodeposition of Thin Magnetic Permalloy Films", J. Electrochem. Soc., 117(3), 403-407 (1970). https://doi.org/10.1149/1.2407524
- Y. Nakamura, "The invar problem", IEEE Trans. Magn., 12(4), 278-291 (1976). https://doi.org/10.1109/TMAG.1976.1059049
- W. D. Callister Jr and D. G. Rethwisch, Materials science and engineering, 9th Ed., p.741 John Wiley & Sons, New Jersey (2014).
- C. Kim, K. Kim, O. Kwon, J. Jung, J. K. Park, D. H. Kim, and K. Jung, "Fine metal mask material and manufacturing process for high-resolution active-matrix organic light-emitting diode displays", J. Soc. Inf. Disp., 28(8), 668-679 (2020). https://doi.org/10.1002/jsid.901
- T. Nagayama, T. Yamamoto, T. Nakamura, and Y. Mizutani, "Fabrication of low CTE metal masks by the Invar Fe-Ni alloy electroforming process for large and fine pitch OLED displays", ECS Trans., 50(52), 117-122 (2013). https://doi.org/10.1149/05052.0117ecst
- A. Li, Z. Zhu, Y. Liu, and J. Hu, "Ultrasound-assisted electrodeposition of Fe-Ni film for OLED mask", Mater. Res. Bull., 127, 110845 (2020). https://doi.org/10.1016/j.materresbull.2020.110845
- S. N. Srimathi, S. M. Mayanna, and B. S. Sheshadri, "Electrodeposition of binary magnetic alloys", Surf. Technol., 16(4), 277-322 (1982). https://doi.org/10.1016/0376-4583(82)90021-8
- T. Nagayama, T. Yamamoto, and T. Nakamura, "Thermal expansions and mechanical properties of electrodeposited Fe-Ni alloys in the Invar composition range", Electrochim. Acta, 205, 178-187 (2016). https://doi.org/10.1016/j.electacta.2016.04.089
- S. H. Kim, H. J. Sohn, Y. C. Joo, Y. W. Kim, T. H. Yim, H. Y. Lee, and T. Kang, "Effect of saccharin addition on the microstructure of electrodeposited Fe-36 wt.% Ni alloy", Surf. Coat. Technol., 199(1), 43-48 (2005). https://doi.org/10.1016/j.surfcoat.2004.11.035
- C. W. Su, F. J. He, H. Ju, Y. B. Zhang, and E. L. Wang, "Electrodeposition of Ni, Fe and Ni-Fe alloys on a 316 stainless steel surface in a fluorborate bath", Electrochim. Acta, 54(26), 6257-6263 (2009). https://doi.org/10.1016/j.electacta.2009.05.076
- Y. Yang, "Preparation of Fe-Co-Ni ternary alloys with electrodeposition", Int. J. Electrochem. Sci., 10(6), 5164-5175 (2015). https://doi.org/10.1016/S1452-3981(23)06694-4
- O. Piotrowski, C. Madore, and D. Landolt, "Electropolishing of titanium & titanium alloys in perchlorate-free electrolytes", Plat. Surf. Finish., 85(5), 115-119 (1998).
- D. Landolt, "Fundamental aspects of electropolishing", Electrochim. (1987).
- A. Sanaty-Zadeh, K. Raeissi, and A. Saidi, "Properties of nanocrystalline iron-nickel alloys fabricated by galvano-static electrodeposition", J. Alloys Compd., 485(1-2), 402-407 (2009). https://doi.org/10.1016/j.jallcom.2009.05.119
- A. Karpuz, H. Kockar, M. Alper, O. Karaagac, and M. Haciismailoglu, "Electrodeposited Ni-Co films from electrolytes with different Co contents", Appl. Surf. Sci., 258(8), 4005-4010 (2012). https://doi.org/10.1016/j.apsusc.2011.12.088
- A. Brenner, Electrodeposition of alloys: principles and practice, Volume I, pp.77-78 Academic Press, New York (1963).
- A. Afshar, A. G. Dolati, and M. Ghorbani, "Electrochemical characterization of the Ni-Fe alloy electrodeposition from chloride-citrate-glycolic acid solutions", Mater. Chem. Phys., 77(2), 352-358 (2003). https://doi.org/10.1016/S0254-0584(02)00017-2
- K. Fukuda, Y. Kashiwa, S. Oue, T. Takasu, and H. Nakano, "Effects of Electrolysis Conditions on the Formation of Electrodeposited Invar Fe-Ni Alloys with Low Thermal Expansion". ISIJ Int., 59(9), 1632-1641 (2019). https://doi.org/10.2355/isijinternational.isijint-2019-023