Acknowledgement
This work was supported by the Korea Institute of Energy Technology Evaluation and Planning(KETEP) and the Ministry of Trade, Industry & Energy(MOTIE) of the Republic of Korea (No, 20194010201810, No. 20194010000050).
References
- Lho Young Hwan, and Yil Suk Yang, "Design of 100V Super Junction Trench Power MOSFET with LowOn Resistance," ETRI Journal, vol.34, no.1, pp.134-137. 2012. DOI: 10.4218/ETRIJ.12.0211.0251
- Z. Hanmei, "Simulation of superjunction MOSFET devices," National university of Singapore, 2005.
- Baliga. B, "Advanced Power MOSFET concepts," Springer Science & Business Media, 2010.
- J. W. Lee, S. G. Kim, J. D. Kim, J. G. Koo, J. Y. Lee and K. S. Nam, "Formation of Passivation Layer and Its Effect on the Defect Generation during Trench Etching," Korean Journal of Materials Research, Vol.7, no.7, pp.634-640, 1998.
- Qian. L. Wang. J., Yang. Z. and Yan. G., "Fabrication of ultra-deep high-aspect-ratio isolation trench Without void and its application," 2010 IEEE 5th Intermational Conference on Nano/Micro Engineered and Molecular Systems, pp.654-657, 2010. DOI: 10.1109/NEMS.2010.5592490
- G. H. Lee, B. S. Ahn and E. G. Kang, "Analysis of Electrical Characteristics According to the Pillar Spacing of 4.5 kV Super Junction IGBT," Journal of the Korean Institute of Electrical and Electronic Material Engineers, vol.33, no.3, pp.173-176, 2020. DOI: 10.4313/JKEM.2020.33.3.173
- H. Bartolf, A. Mihaila, I. Nistor, M. Jurisch, B. Leibold and M. Zimmermann, "Development of a 60um Deep Trench and Refill Process for Manufacturing Si-Based High-Voltage Super-Junction Structures," IEEE Transactions on Semiconductor Manufacturing, vol.26, no.4, pp. 529-541, 2013. DOI: 10.1109/TSM.2013.2272042