과제정보
이 논문은 충북대학교 국립대학육성사업(2020)지원을 받아 작성되었습니다.
참고문헌
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피인용 문헌
- A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste vol.39, pp.4, 2021, https://doi.org/10.5781/jwj.2021.39.4.5