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The defect detection circuit of an electronic circuit through impedance change detection that induces a change in S-parameter

S-parameter의 변화를 유도하는 임피던스 변화 감지를 통한 전자회로의 결함검출회로

  • Seo, Donghwan (The 2nd Directorate, Defense Test & Evaluation Research Institute, Agency for Defense Development) ;
  • Kang, Tae-yeob (The 2nd Directorate, Defense Test & Evaluation Research Institute, Agency for Defense Development) ;
  • Yoo, Jinho (Dept. of Electronics Engineering, Soongsil University) ;
  • Min, Joonki (The 2nd Directorate, Defense Test & Evaluation Research Institute, Agency for Defense Development) ;
  • Park, Changkun (Dept. of Electronics Engineering, Soongsil University)
  • Received : 2021.11.25
  • Accepted : 2021.12.27
  • Published : 2021.12.31

Abstract

In this paper, in order to apply Prognostics and Health Management(PHM) to an electronic system or circuit, a circuit capable of detecting and predicting defect characteristics inside the system or circuit is implemented, and the results are described. In the previous study, we demonstrated that the frequency of the amplitude of S-parameter changed as the circuit defect progressed. These characteristics were measured by network analyser. but in this study, even if the same defect detection method is used, a circuit is proposed to check the progress of the defect, the remaining time, and the occurrence of the defect without large measurement devices. The circuit is designed to detect the change in impedance that generates changes of S-parameter, and it is verified through simulation using the measurement results of Bond-wires.

본 논문에서는 고장예측진단 및 건전성 관리 기법(Prognostics and Health Management, PHM)을 적용하기 위해 해당 시스템 혹은 회로 내부에서 결함특성을 감지하고 예측할 수 있는 회로 구조를 제안하였다. 기존 연구에서 회로 결함의 진행에 따라, S-parameter 크기 최소값의 주파수가 변화하는 것을 확인하였다. 이러한 특성을 기존에는 네트워크 분석기(Network Analyzer)를 활용하여 측정하였으나, 본 연구에서는 같은 결함검출기법을 활용하더라도 큰 계측장비 없이 결함의 진행상황 및 잔여 수명, 결함발생 여부를 확인할 수 있는 소형화된 회로를 설계하였다. 본 연구에서는 S-parameter의 변화를 야기하는 임피던스의 변화를 감지할 수 있도록 회로를 설계하였으며, Bond-wire의 온도반복에 따른 S-parameter 변화 측정결과를 제안하는 회로에 적용하였다. 이를 통해 해당 회로가 Bond-wire의 결함을 감지할 수 있다는 것을 성공적으로 검증하였다.

Keywords

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