PE-CVD 장비의 샤워헤드 표면 온도 모니터링 방법

Showerhead Surface Temperature Monitoring Method of PE-CVD Equipment

  • 왕현철 (한국기술교육대학교 전기전자통신공학과) ;
  • 서화일 (한국기술교육대학교 전기전자통신공학과)
  • Wang, Hyun-Chul (School of Electrical, Electronics and Communication Engineering Korea University of Technology and Education) ;
  • Seo, Hwa-Il (School of Electrical, Electronics and Communication Engineering Korea University of Technology and Education)
  • 투고 : 2020.05.25
  • 심사 : 2020.06.11
  • 발행 : 2020.06.30

초록

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

키워드

참고문헌

  1. Y. Park, J. Lee, S. S. Cho, G. Jin, and E. Jung, "Scaling and Reliability of NAND Flash Devices," in Proc. IEEE Int. Reliab. Symp., pp. 2E.1.1-2E.1.4, Jun., 2014.
  2. Y. Kim, J.-G. Yun, S. H. Park, W. Kim, J. Y. Seo, M. Kang, K.-C. Ryoo, J.-H. Oh, J.-H. Lee, H. Shin, and B.- G. Park, "Three-Dimensional NAND Flash Architecture Design Based on Single-Crystalline Stacked Array," IEEE Trans Electron Devices, vol.59, no.1, pp. 35-45, Jan., 2012. https://doi.org/10.1109/TED.2011.2170841
  3. H.C. Wang and H.I. Seo, "RF Loss Minimization Method Using High Impedance Filter for Research" J. of the Semiconductor & Display Technology, Vol. 19, No. 1, pp. 55-60, 2020.
  4. J.H. Choi, S.C. Roh, J.D. Jung and H.I. Seo, "The Silicon Nitride Films according to The Frequency Conditions of Plasma Enhanced Chemical Vapor Deposition" J. of the Semiconductor & Display Technology, Vol. 13, No. 13, pp. 21-25, 2014.
  5. K.J. Jo and S.J. Hong, "Improved Self Plasma-Optical Emission Spectroscopy for In-situ Plasma Process Monitoring", J. of the Semiconductor & Display Technology, Vol. 16, No. 2, pp. 75-78, 2017.
  6. Ho Jae Lee, Dong Sun Seo, Sang Jeen Hong, Gary S.May, "PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data", Transactions on Electrical and Electronic Materials, Vol. 14, no. 5, pp.254-257, 2013. https://doi.org/10.4313/TEEM.2013.14.5.254
  7. S. C. Kim "A Semiconductor Etching Process Monitoring System Development using OES Sensor", J. of the Korea society of computer and information, Vol.18, No.3, 2013.
  8. Young-Kee Ryu, Choon-Suk Oh, Seo-Young Lee, "A Noncontact Optical Sensor Development for Measuring the Thickness of Transparent Plates", J. of Electronics Engineers of Korea, Vol.43, no.1, 2006.