반도체 장비 히터로드 유착 개선에 관한 연구

A Study on Improvement of Heater Rod Adhesion in Semiconductor Equipment

  • 왕현철 (한국기술교육대학교 전기전자통신공학과) ;
  • 서화일 (한국기술교육대학교 전기전자통신공학과)
  • Wang, Hyun-Chul (School of Electrical, Electronics and Communication Engineering Korea University of Technology and Education) ;
  • Seo, Hwa-Il (School of Electrical, Electronics and Communication Engineering Korea University of Technology and Education)
  • 투고 : 2020.03.10
  • 심사 : 2020.03.23
  • 발행 : 2020.03.31

초록

This study analyzes the method of adhesion and improvement between heat.er and RF filter in PE-CVD equipment through TRIZ method and proposes a solution. TRIZ Solution such as function analysis, 9-window matrix, ASIT, and Root cause analysis were used. The contact temperature between the heater and the RF filter was 20% and the surface temperature was lowered to 5.7℃, suggesting an improvement method for the thermal expansion of the PE-CVD equipment hot zone.

키워드

참고문헌

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