한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제33권1호
  • /
  • Pages.60-64
  • /
  • 2020
  • /
  • 1226-7945(pISSN)
  • /
  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
권호 표지
DOI QR코드

DOI QR Code

온도와 습도에 따른 초고압 변압기용 앵글링 프레스보드 특성

Angle Ring Press Board Characteristic in Accordance with Temperature and Humidity for High Voltage Transformer

  • 서왕벽 (영남대학교 기계IT대학 기계공학부)
  • Suh, Wang Byuck (Department of Mechanical Engineering, College of Mechanical and IT Engineering, Yeungnam University)
  • 투고 : 2019.11.13
  • 심사 : 2019.11.18
  • 발행 : 2020.01.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this study, to develop angle ring pressboards for high voltage transformers, the radius and thickness are modified under the conditions of temperature and humidity. In particular, a pressboard with a thickness of 6 mm and a radius at the angled part were investigated based on the simulation of the principal stress from the angled optimization profile shape. As a result, by the appropriate application of a higher temperature, the solid insulation can be improved to reduce the moisture content for an optimized profile angle of a high voltage transformer. This also results in the improvement of the safety factor by 25%. It is determined that the electrical insulation properties of pressboards in high voltage transformers can be enhanced by improving their properties.

키워드

참고문헌

  1. L. S. Nasrat, N. Kassem, and N. Shukry, Engineering, 7, 1 (2013). [DOI: https://doi.org/10.4236/eng.2013.51001]
  2. R. Liao, J. Hao, G. Chen, Z. Ma, and L. Yang, IEEE Trans. Dielectr. Electr. Insul., 18, 1626 (2011). [DOI: https://doi.org/10.1109/TDEI.2011.6032833]
  3. H. P. Gasser, C. Krause, and T. A. Prevost, Proc. Conference Record of the 2006 IEEE International Symposium on Electrical Insulation (IEEE, Toronto, Canada, 2006) p. 403. [DOI: https://doi.org/10.1109/ELINSL.2006.1665343]
  4. H. Z. Ding, Z. D. Wang, and P. Jarman, Proc. 2007 IEEE International Conference on Solid Dielectrics (IEEE, Winchester, UK, 2007) p. 106. [DOI: https://doi.org/10.1109/ICSD.2007.4290764]
  5. C. Krause, P. Brupbacher, A. Fehlmann, and B. Heinrich, Proc. IEEE International Conference on Dielectric Liquids, 2005. ICDL 2005 (IEEE, Coimbra, Portugal, 2005). [DOI: https://doi.org/10.1109/ICDL.2005.1490102]