DOI QR코드

DOI QR Code

Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화

Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy

  • Choi, Jin-Ju (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE)) ;
  • Kang, Yubin (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE)) ;
  • Im, Byoungyong (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE)) ;
  • Lee, Chan-Gi (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE)) ;
  • Kim, Hangoo (NEDEC) ;
  • Park, Kwang Hoon (Program in Metals and Materials Process Engineering, Inha University) ;
  • Kim, Dae-Guen (Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE))
  • 투고 : 2019.10.08
  • 심사 : 2019.12.11
  • 발행 : 2020.01.27

초록

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 ㎛ were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

키워드

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