과제정보
연구 과제 주관 기관 : 한국연구재단
본 연구는 정부(교육부)의 재원으로 한국연구재단의 지원(No.2018 R1D1A3B07045339)으로 수행되었습니다.
참고문헌
- Leong, Y.W, Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, U.S. and Tsujii, T., "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix", Polym. Eng. Sci., Vol. 44, No. 12, pp. 2327-2334. 2004. https://doi.org/10.1002/pen.20260
- Oulu, P.N., Kempele, S. and Kempele, P.R., "Multilayer structure for accommodating electronics and related method of manufacture", Tacto Tek Oy, US Patent, No. 9724869B2, 2017.
- Dupont, In-Mold Electronic Technology, http://www.dupont.com/products-and-services/electronic-electrical-materials/printed-electronics/products/in-mold-electronic-technology.html.
- Liu, R.H., Young, W.B. and Ming, H.P., "Design of the printing pattern on film for three dimensional molded interconnect devices, Adv Polym Technol", Vol. 37, No. 6 ,pp. 1722-1731, 2018. https://doi.org/10.1002/adv.21830
- Islam, A., Hansen, H.N. and Giannekas, N., "Quality investigation of miniaturized moulded interconnect devices(MIDs) for hearing aid application", Manufacturing Technology, Vol. 64, No.1, pp. 539-544, 2015.
- Poller, S. and Michaeli, W., "Film temperatures determine the wall thickness of thermoformed parts", SPE ANTEC, Vol. 38, No. 1 , pp. 104-108, 1992.
- Yoo, Y. G. and Lee, H. S., "Effects of processing conditions on thickness distribution for a laminated film during vacuum-assisted thermoforming", Trans. Mater. Process., Vol. 20, No. 3, pp. 250-256, 2011. https://doi.org/10.5228/KSTP.2011.20.3.250
- Yoo, Y. G. and Lee, H. S., "Numerical and experimental analysis of laminated-film thickness variation in vacuum-assisted thermoforming", Trans. Mater. Process., Vol. 22, No. 3, pp. 171-177, 2013. https://doi.org/10.5228/KSTP.2013.22.3.171
- Lee, J. K., Virkler, T. L. and Scott, C. E., "Effects of rheological properties and processing parameters on ABS thermoforming", Polym. Eng. Sci., Vol. 41, No. 2, pp. 240-261, 2001. https://doi.org/10.1002/pen.10725
- Seong, G.S., Lee, H.S., "A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming", J. Korea Society of Die & Mold Engineering, Vol. 12, No. 2, 2018.
- Hwang, H. S., "A study on a wash-out phenomenon in two-component injection molding", Proc. KSTP Spring Conf., pp.233-237, 2013.
- Son, J.W., Lee, S.H. and Lee, H.S., "Experimental study on wash-out and warpage in in-mold coating with film inserts, Trans. Korea Soc. Mech. Eng. A, Vol. 42, No. 3, pp. 213-219, 2018. https://doi.org/10.3795/KSME-A.2018.42.3.213
- Acuuform, "Computer Simulations of Transforming and Blowing Molding", http://www.t-sim.com/index.html, 2005.
- Phadke, M. S., "Quality Engineering using Robust Design", AT&T Bell Lab., Prentice Hall, 1992.