Design & Manufacturing

Korean Society of Die & Mold Engineering (한국금형공학회)
권호 표지

A study on the molding of dome shaped plastic parts embedded with electronic circuits

전자회로 일체형 돔 형상의 플라스틱 부품 성형에 관한 연구

  • Seong, Gyeom-Son (Dep. of Aeronautical & Mechanical Design Eng., Korea Nat'l Univ. of Transportation) ;
  • Lee, Ho-Sang (Dep. of Aeronautical & Mechanical Design Eng., Korea Nat'l Univ. of Transportation)
  • 성겸손 (한국교통대학교 항공.기계설계학과) ;
  • 이호상 (한국교통대학교 항공.기계설계학과)
  • Received : 2020.03.10
  • Accepted : 2020.03.31
  • Published : 2020.03.31
Download PDF
⟨ Previous Next ⟩

Abstract

Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

Keywords

Acknowledgement

Supported by : 한국연구재단

본 연구는 정부(교육부)의 재원으로 한국연구재단의 지원(No.2018 R1D1A3B07045339)으로 수행되었습니다.

References

  1. Leong, Y.W, Yamaguchi, S., Mizoguchi, M., Hamada, H., Ishiaku, U.S. and Tsujii, T., "The effect of molding conditions on mechanical and morphological properties at the interface of film insert injection molded polypropylene-film/polypropylene matrix", Polym. Eng. Sci., Vol. 44, No. 12, pp. 2327-2334. 2004. https://doi.org/10.1002/pen.20260
  2. Oulu, P.N., Kempele, S. and Kempele, P.R., "Multilayer structure for accommodating electronics and related method of manufacture", Tacto Tek Oy, US Patent, No. 9724869B2, 2017.
  3. Dupont, In-Mold Electronic Technology, http://www.dupont.com/products-and-services/electronic-electrical-materials/printed-electronics/products/in-mold-electronic-technology.html.
  4. Liu, R.H., Young, W.B. and Ming, H.P., "Design of the printing pattern on film for three dimensional molded interconnect devices, Adv Polym Technol", Vol. 37, No. 6 ,pp. 1722-1731, 2018. https://doi.org/10.1002/adv.21830
  5. Islam, A., Hansen, H.N. and Giannekas, N., "Quality investigation of miniaturized moulded interconnect devices(MIDs) for hearing aid application", Manufacturing Technology, Vol. 64, No.1, pp. 539-544, 2015.
  6. Poller, S. and Michaeli, W., "Film temperatures determine the wall thickness of thermoformed parts", SPE ANTEC, Vol. 38, No. 1 , pp. 104-108, 1992.
  7. Yoo, Y. G. and Lee, H. S., "Effects of processing conditions on thickness distribution for a laminated film during vacuum-assisted thermoforming", Trans. Mater. Process., Vol. 20, No. 3, pp. 250-256, 2011. https://doi.org/10.5228/KSTP.2011.20.3.250
  8. Yoo, Y. G. and Lee, H. S., "Numerical and experimental analysis of laminated-film thickness variation in vacuum-assisted thermoforming", Trans. Mater. Process., Vol. 22, No. 3, pp. 171-177, 2013. https://doi.org/10.5228/KSTP.2013.22.3.171
  9. Lee, J. K., Virkler, T. L. and Scott, C. E., "Effects of rheological properties and processing parameters on ABS thermoforming", Polym. Eng. Sci., Vol. 41, No. 2, pp. 240-261, 2001. https://doi.org/10.1002/pen.10725
  10. Seong, G.S., Lee, H.S., "A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming", J. Korea Society of Die & Mold Engineering, Vol. 12, No. 2, 2018.
  11. Hwang, H. S., "A study on a wash-out phenomenon in two-component injection molding", Proc. KSTP Spring Conf., pp.233-237, 2013.
  12. Son, J.W., Lee, S.H. and Lee, H.S., "Experimental study on wash-out and warpage in in-mold coating with film inserts, Trans. Korea Soc. Mech. Eng. A, Vol. 42, No. 3, pp. 213-219, 2018. https://doi.org/10.3795/KSME-A.2018.42.3.213
  13. Acuuform, "Computer Simulations of Transforming and Blowing Molding", http://www.t-sim.com/index.html, 2005.
  14. Phadke, M. S., "Quality Engineering using Robust Design", AT&T Bell Lab., Prentice Hall, 1992.