• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.1-8
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• 2020

In this paper, the principles, characteristics and recent studies of the laser micro soldering are reviewed. The factors which influence laser micro welding and soldering are also included. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled laser beam. In recent electronics industry, the demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro-joint. In laser soldering, there are several important factors like laser absorption, laser power, laser scanning speed, and etc, which affect laser solderability. The laser absorption ratio depends on materials, and each material has different absorption or reflectivity for the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance, and these are also reviewed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.7-13
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• 2019

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

• International Journal of Clinical Preventive Dentistry
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• v.14 no.4
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• pp.247-255
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• 2018

Objective: Osseointegration is essential process for successful implants and effects to implant in long term, therefore, passive fitness of good prosthesis is necessary. To make a good prosthesis, at first it should be done a sectioned casting and then joined method of sectioned casting body is recommended. Methods: In this study, to provide the fundamental data on stable connection method for successful implants, the author tested fitness of casting body, and compared difference between gas soldering technique and laser welding technique. Results: In fitness test of 2 abutment (test A, C), gas soldering group's fitness in the opposite part of connection was worse than laser welding group. In fitness test of 3 abutment (test B, D), gap distance was increased both in gas soldering technique and laser welding technique. Gap distance at the connecting part and the opposite part of the abutment in gas soldering technique was worse than laser welding technique and the more additional abutment, the worse gap distance in gas soldering technique. In fitness test of 3 abutment (test B, D), there's little variation in No. 2 abutment when connecting soldering process was done and there's little influence on already soldered connection part when the additional soldering connection was done. Conclusion: On weak loading condition and the part which is needed an accuracy, laser welding technique is more effective and on long-span prosthesis and frequent chewing loading part, laser welding technique is recommended first and applying additional gas soldering technique would be better for making much more successful prosthesis.

• Journal of Technologic Dentistry
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• v.30 no.1
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• pp.49-55
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• 2008

In this study, to provide the fundamental data on stable connection method for successful implants prosthesis, We fabricated the solder joint of gold alloy bar specimens by gas flame soldering method and laser welding and soldering method. It compared and studied the tensile strength of two soldering method by universal testing machine. The results using universal testing machine were as follow : The mean of tensile strength of solder joint bar in gas flame soldering method specimens was 363.89 $\pm$17.62 MPa, and the mean strength of laser welding and soldering method was 125.91 $\pm$ 19.66 MPa, so gas flame soldering method was better than laser welding and soldering method and the finding better way to improve tensile strength is needed in laser welding method. On weak loading condition and the part which is needed an accuracy, laser welding method is more effective and on long-span prosthesis and frequent chewing loading part, laser welding technique is recommended first and applying additional gas flame soldering technique would be better for making much more successful prosthesis.

• Laser Solutions
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• v.2 no.1
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• pp.38-42
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• 1999

As very large scale integration technology has been developed, much more accurate, reliable technology is needed for outer lead bonding. Laser soldering has been researched as an alternative for fine pitch device bonding. This study is focused on how to select optimal laser soldering variables with which solder wets parent material, the microstructural results of laser soldering and the reliability test One of popular packages, QFP100 was soldered successfully with two kinds of solder. The inspection of the joint for reliability was carried out by optical microscope, SEM, EDAX and pull test, which demonstrated the superiority of laser soldering.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.661-662
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• 2006

This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300, $500{\mu}m$ size are used in experiments. The laser head to deliver a laser beam and the nozzle to transfer solder-balls are manufactured to bump solder-balls. After soldering solder-balls the shear test is carried out to determine the wetting at the interface between the surface and a solder-balls With the results of solder bumping tests a laminated molding is accomplished for manufacturing the three dimensional molding.

• Corrosion Science and Technology
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• v.8 no.5
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• pp.184-187
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• 2009

The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

• Journal of Technologic Dentistry
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• v.36 no.4
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• pp.239-246
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• 2014

Purpose: The purpose of this study was to compare the tensile strength and mechanical properties of orthodontic wire joints made by gas soldering and laser welding, with and without filling material, to identify the effectiveness and potential clinical application of laser welded orthodontic wires. Methods: Three joint configurations of orthodontic wire were used: diameter 0.9 to 0.9 mm wire, diameter 0.9 to 0.5 wire and diameter 0.9 mm wire to band. The joints were made using three different methods: gas soldering, laser welding with and without filling material. For each kind of joint configuration or connecting method 7 specimens were carefully produced. The tensile strengths were measured with a universal testing machine (Zwick/Roell, Instron, USA). The hardness measurements were carried out with a hardness tester(Future-Tech Co. Tokyo, Japan). Data were analyzed by AVOVA(p= .05) and Turkey HD test(p= .05). Results: In all cases, gas soldering joints were ruptured on a low level on tensile bonding strength. Significant differences between laser welding and gas soldering(p< .05) were found in each joint configuration. The highest tensile strength means were observed for laser welding, with filling material, of 0.9 to 0.9 mm wire joint. Conclusion: In conclusion, the elastic modulus and tensile strength means of laser soldering with filling material were the highest, and the tensile strength means of laser soldering were higher than those of gas soldering.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.231-233
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• 2005

Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.165-168
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• 1997