Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders

웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성

  • Jeon, Wook Sang (Department of Materials Science and Engineering, University of Seoul) ;
  • Rajendran, Sri Harini (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
  • 전욱상 (서울시립대학교 신소재공학과) ;
  • ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2019.08.20
  • Accepted : 2019.09.04
  • Published : 2019.09.30
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Abstract

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

Keywords

References

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