Journal of the Korea Institute of Military Science and Technology (한국군사과학기술학회지)

The Korea Institute of Military Science and Technology (한국군사과학기술학회)
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A Study on Adhesive Crosslinked in Low Temperature for High Temperature Aerospace Application

우주항공용 저온 경화 접착제의 고온 물성에 관한 연구

  • 송정근 (국방과학연구소 제4기술연구본부) ;
  • 우현률 (국도화학 CNC 소재연구개발) ;
  • 이금미 (국도화학 CNC 소재연구개발) ;
  • 최두현 (국방과학연구소 제4기술연구본부)
  • Received : 2018.11.29
  • Accepted : 2019.03.22
  • Published : 2019.04.05
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Abstract

A high temperature adhesive development which is crosslinked in low temperature is necessary for aerospace application because of thermal expansion mismatches of various substrates. For this purpose, we have designed and fabricated several formulations with high temperature epoxy resins, crosslinkers and additives considering various working conditions and high service temperature. As a result, some formulations showed higher adhesive strengths than Hysol EA 9394/C2 which is widely used for aerospace applications. We also have studied and summarized the mechanical properties of the best development adhesive in both room and high temperatures.

Keywords

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Fig. 1. DMA graghs of Hysol EA 9394/C2 and No. 5 adhesives

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Fig. 2. TGA thermograms of Hysol EA 9394/C2 and No. 5 adhesives

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Fig. 3. Creep test graghs of Hysol EA 9394/C2 and No. 5 adhesives

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Fig. 4. Thermal expansion coefficient graghs of Hysol EA 9394/C2 and No. 5 adhesives

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Fig. 5. Images of tensile lap shear strength tests at high temperature

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Fig. 6. Images of adhesive failures in tensile lap shear strength tests(Hysol EA 9394/C2(left) and No. 5 adhesives(right))

Table 1. Formulations of high thermal resistant epoxy resins

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Table 2. Formulations of a high thermal resistant crosslinker

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Table 3. The measurements for tensile lap shear strength(MPa) of various formulations with Hysol EA 9394/C2

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Table 4. The measurements for glass transition temperatures(℃) of various formulations with Hysol EA 9394/C2

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Table 5. Tensile properties(MPa) of Hysol EA 9394/C2 and No. 5 adhesives at room temperature

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Table 6. Compressive properties(MPa) of Hysol EA 9394/C2 and No. 5 adhesives at room temperature

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Table 7. Poisson’s ratio of Hysol EA 9394/C2 and No. 5 adhesives

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Table 8. Creep test results of Hysol EA 9394/C2 and No. 5 adhesives

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Table 9. Thermal expansion coefficients of Hysol EA 9394/C2 and No. 5 adhesives

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Table 10. Thermal conductivities of Hysol EA 9394/C2 and No. 5 adhesives

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Table 11. Tensile properties(MPa) of Hysol EA 9394/C2 and No. 5 adhesives at 232 ℃

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Table 12. Compressive properties(MPa) of Hysol EA 9394/C2 and No. 5 adhesives at 232 ℃

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Table 13. The measurements for tensile lap shear strength(MPa) of Hysol EA 9394/C2 and No. 5 adhesives at high temperature

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