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http://dx.doi.org/10.9766/KIMST.2019.22.2.215

A Study on Adhesive Crosslinked in Low Temperature for High Temperature Aerospace Application  

Song, Jung Kun (The 4th Research and Development Institute, Agency for Defense Development)
Woo, Hyun Ryul (CNC R&D Group Kukdo)
Lee, Geum Mi (CNC R&D Group Kukdo)
Choi, Doo Hyun (The 4th Research and Development Institute, Agency for Defense Development)
Publication Information
Journal of the Korea Institute of Military Science and Technology / v.22, no.2, 2019 , pp. 215-223 More about this Journal
Abstract
A high temperature adhesive development which is crosslinked in low temperature is necessary for aerospace application because of thermal expansion mismatches of various substrates. For this purpose, we have designed and fabricated several formulations with high temperature epoxy resins, crosslinkers and additives considering various working conditions and high service temperature. As a result, some formulations showed higher adhesive strengths than Hysol EA 9394/C2 which is widely used for aerospace applications. We also have studied and summarized the mechanical properties of the best development adhesive in both room and high temperatures.
Keywords
High Temperature Properties; Aerospace Adhesive;
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