A Study on Adhesive Crosslinked in Low Temperature for High Temperature Aerospace Application |
Song, Jung Kun
(The 4th Research and Development Institute, Agency for Defense Development)
Woo, Hyun Ryul (CNC R&D Group Kukdo) Lee, Geum Mi (CNC R&D Group Kukdo) Choi, Doo Hyun (The 4th Research and Development Institute, Agency for Defense Development) |
1 | L. Tong and G. P. Steven, "Analysis and Design of Structural Bonded Joint," Kluwer Academic Publishers, Dordrecht, p. 2, 1999. |
2 | A. Pirondi and G. Nicoletto, "Mixed Mode I/II Fracture Toughness of Bonded Joints," Int. J. Adhes. Adhes., Vol. 20, pp. 109-117, 2002. |
3 | A. Higgins, "Adhesive Bonding of Aircraft Structures," Int J. Adhes. Adhes., Vol. 20, pp. 367-376, 2000. DOI |
4 | O. Lunder, B. Olsen and K. Nisancioglu, "Pretreatment of AA6060 Aluminum Alloy for Adhesive Bonding," Int. J. Adhes. Adhes., Vol. 22, pp. 143-150, 2002. DOI |
5 | R. S. Bauer, "Epoxy Resin Chemistry," Advanced in Chemistry Series, American Chemical Society, Washington DC, p. 1, 1979. |
6 | C. A. May, "Epoxy Resins, Chemistry and Technology," Marcel Dekker, New York, p. 1, 1988. |
7 | Yuan Xiang Fu, Zhuo-Xian He, Dong Chuan Mo, Shu-Shen Lu, "Thermal Conductivity Enhancement with Different Fillers for Epoxy Resin Adhesives," Applied Thermal Engineering Vol. 66, pp. 493-4798, 2014. DOI |
8 | Peerapan Dittanet, Raymond A. Pearson, "Effect of Silica Nanoparticle Size on Toughening Mechanisms of Filled Epoxy", Polymer Vol. 53, pp. 1890-1905, 2012. DOI |