Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Atomic Layer Deposition for Powder Coating

분말 코팅을 위한 원자층 증착법

  • Choi, Seok (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Han, Jeong Hwan (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Choi, Byung Joon (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 최석 (서울과학기술대학교 신소재공학과) ;
  • 한정환 (서울과학기술대학교 신소재공학과) ;
  • 최병준 (서울과학기술대학교 신소재공학과)
  • Received : 2019.05.31
  • Accepted : 2019.06.10
  • Published : 2019.06.28
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Abstract

Atomic layer deposition (ALD) is widely used as a tool for the formation of near-atomically flat and uniform thin films in the semiconductor and display industries because of its excellent uniformity. Nowadays, ALD is being extensively used in diverse fields, such as energy and biology. By controlling the reactivity of the surface, either homogeneous or inhomogeneous coating on the shell of nanostructured powder can be accomplished by the ALD process. However, the ALD process on the powder largely depends on the displacement of powder in the reactor. Therefore, the technology for the fluidization of the powder is very important to redistribute its position during the ALD process. Herein, an overview of the three types of ALD reactors to agitate or fluidize the powder to improve the conformality of coating is presented. The principle of fluidization its advantages, examples, and limitations are addressed.

Keywords

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