References
- Antonelli, G.A., Perrin, B., Daly, B.C., Cahill D.G. (2006) Characterization of Mechanical and Thermal Properties Using Ultrafast Optical Metrology, MRS Bulletin, 31, pp.607-613. https://doi.org/10.1557/mrs2006.157
- Cho, M., Choi, J., Jung, K. (2007) Multi-scale Analysis of Thin Film Considering Surface Effects, J. Comput. Struct. Eng. Inst. Korea, 20, pp. 287-292.
- Feng, B., Li, Z., Zhang, X. (2009) Prediction of Size Effect on Thermal Conductivity of Nanoscale Metallic Films, Thin Solid Films, 517, pp. 2803-2807. https://doi.org/10.1016/j.tsf.2008.10.116
- Frenkel, D., Smit, B. (1996) Understanding Molecular Simulation, San Diego, USA: Academic Press Inc.
- Hopkins, P.E. (2013) Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance, ISRN Mech. Eng., 2013.
- Ikeshoji, T., Hafskjold, B. (1993) Non-equilibrium Molecular Dynamics Calculation of Heat Conduction in Liquid and Through Liquid-gas Interface, Mol. Phys., 81, pp.251-261. https://doi.org/10.1080/00268979400100171
- Jelinek, B., Groh, S., Horstemeyer, M.F., Houze, J., Kim, S.G., Wagner, J.G., Moitra, A., Baskes, M.I. (2012) Modified Embedded Atom Method Potential for Al, Si, Mg, Cu, and Fe Alloys, Phys. Rev. B, 85(24), p.245102. https://doi.org/10.1103/PhysRevB.85.245102
- Jung, G., Zhou, M., Cho, M. (2012) Analysis on Thermomechanical Response to Tensile Deformation of GaN Nanowires, J. Comput. Struct. Eng. Inst. Korea, 25, pp.301-305. https://doi.org/10.7734/COSEIK.2012.25.4.301
- Kim, Y.Y., Krishnaswamy, S. (2012) Non-destructive Evaluation of Material Properties of Nanoscale Thin-films Using Ultrafast Optical Pump-probe Methods, J. Korean Soc. Nondestruct. Test., 35, pp.115-121.
- Muller-Plathe, F. (1997) A Simple Nonequilibrium Molecular Dynamics Method for Calculating the Thermal Conductivity, J. Chem. Phys., 106, p. 6082. https://doi.org/10.1063/1.473271
- Plimpton, S. (1995) Fast Pparallel Algorithms for Short-Range Molecular Dynamics, J. Comput. Phys., 117, pp.1-19. https://doi.org/10.1006/jcph.1995.1039
- Richardson, C.J.K., Spicer, J.B. (2003) Characterization of Heat-treated Tungsten Thin Films Using Picosecond Duration Thermoelastic Transients, Optics & Lasers Eng., 40, pp. 379-391. https://doi.org/10.1016/S0143-8166(02)00090-8
- Shin, H., Yang, S., Yu, S., Chang, S., Cho, M. (2012) A Study on the Sequential Multiscale Homogenization Method to Predict the Thermal Conductivity of Polymer Nanocomposites with Kapitza Thermal Resistance, J. Comput. Struct. Eng. Inst. Korea, 25, pp.315-321. https://doi.org/10.7734/COSEIK.2012.25.4.315
- Stevens, R.J., Smith, A.N., Norris, P.M. (2005) Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique, J. Heat Transf., 127, pp. 315-322. https://doi.org/10.1115/1.1857944
- Stoner, R.J., Maris, H.J. (1993) Kapitza Conductance and Heat Flow Between Solids at Temperatures From 50 to 300K, Phys. Rev.B, 48, pp.16373-16387. https://doi.org/10.1103/PhysRevB.48.16373
- Yang, N., Luo, T., Esfarjani, K., Henry, A., Tian, Z., Shiomi, J., Chalopin, Y., Li, B., Chen, G. (2015) Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations, J. Comput. & Theor. Nanosci., 12, pp.168-174. https://doi.org/10.1166/jctn.2015.3710