DOI QR코드

DOI QR Code

Graphene, Cu와 Ag 나노 파우더를 이용한 열전도재의 방열 특성에 관한 연구

A study on the heat dissipation characteristic of thermal interface materials with Graphene, Cu and Ag nano powders

  • 박상혁 (경상대학교 일반대학원 에너지기계공학과) ;
  • 임성훈 (한국폴리텍 창원캠퍼스 컴퓨터응용공학과) ;
  • 김현지 (경상대학교 일반대학원 에너지기계공학과) ;
  • 노정필 (경상대학교 에너지기계공학과) ;
  • 허선철 (경상대학교 에너지기계공학과)
  • Park, Sang-Hyeok (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.) ;
  • Im, Sung-Hoon (Dept. of Computer Aided Machinery, Changwon Campus of Korea Polytechnic) ;
  • Kim, Hyun-Ji (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.) ;
  • Noh, Jung-Pil (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.) ;
  • Huh, Sun-Chul (Dept. of Energy and Mechanical Engineering, Gyeongsang Nat'l Univ.)
  • 투고 : 2019.10.28
  • 심사 : 2019.12.05
  • 발행 : 2019.12.31

초록

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

키워드

참고문헌

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