세라미스트 (Ceramist)

  • 제21권2호
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  • Pages.83-88
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  • 2018
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  • 1226-976X(pISSN)
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  • 2586-0631(eISSN)
한국세라믹학회 (The Korean Ceramic Society)
권호 표지

방열기판 전극형성 기술 동향

  • 김단비 (한국기계연구원 부설 재료연구소) ;
  • 김지원 (한국기계연구원 부설 재료연구소) ;
  • 엄누시아 (한국기계연구원 부설 재료연구소) ;
  • 임재홍 (한국기계연구원 부설 재료연구소)
  • 발행 : 2018.06.30
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초록

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

키워드

참고문헌

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