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Organosilicon LED Encapsulants Based on Polysiloxane and Polysilazane

폴리실록산과 폴리실라잔 기반 유기실리콘 LED 봉지재의 제조

  • Eun, Hee Chun (Department of Organic Materials and Fiber Engineering, Soongsil University) ;
  • Huh, Tae-Hwan (Department of Organic Materials and Fiber Engineering, Soongsil University) ;
  • Kwark, Young-Je (Department of Organic Materials and Fiber Engineering, Soongsil University)
  • 은희천 (숭실대학교 유기신소재.파이버공학과) ;
  • 허태환 (숭실대학교 유기신소재.파이버공학과) ;
  • 곽영제 (숭실대학교 유기신소재.파이버공학과)
  • Received : 2018.05.17
  • Accepted : 2018.06.13
  • Published : 2018.06.30

Abstract

A mixture of polysiloxane (PSO) and polysilazane (PSZ) was used to prepare a crosslinked organosilicon material for use as an LED encapsulant. The crosslinking was conducted by using two different chemistries: platinum-catalyzed hydrosilylation and peroxide-initiated radical reaction. Successful crosslinking was confirmed by FT-IR spectroscopy, which showed decreased intensities of vinyl ($3,100cm^{-1}$) and hydrosilane ($2,140cm^{-1}$) peaks. The prepared films showed high transparency (>90% at 400 nm) because of the high compatibility between PSO and PSZ. The crosslinked organosilicon films showed higher hardness values when both PSO and PSZ were used at the same time, indicating higher crosslinking density.

Keywords

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