References
- P. J. Kelly and R. D. Arnell, Vaccum 56, 159-172 (2000). https://doi.org/10.1016/S0042-207X(99)00189-X
- W. Gao, Z. Li, Ceram. Int. 30, 1155-1159 (2004). https://doi.org/10.1016/j.ceramint.2003.12.197
- K. Sarakinos, J. Alami, and S. Konstantinidis, Surf. Coat. Tech. 204, 1661-1684 (2010). https://doi.org/10.1016/j.surfcoat.2009.11.013
- K. Ellmer and T. Welzel, J. Mater. Res. 27, 765-779 (2012). https://doi.org/10.1557/jmr.2011.428
- S. H. Jeong and J. H. Boo, Thin Solid Films 447-448, 105-110 (2004).
- S. Mraz and J. M. Schneider, J. Appl. Phys. 100, 023503 (2006). https://doi.org/10.1063/1.2216354
- M.-J. Keum and J.-H. Han J. Korean Phys. Soc. 53, 1580-1583 (2008). https://doi.org/10.3938/jkps.53.1580
- H. C. Nguyen, T. T. Trinh, T. Le, C. V. Tran, T. Tran, H. Park, V. A. Dao, and J. Yi, Semicond. Sci. Technol. 26, 105022 (2011). https://doi.org/10.1088/0268-1242/26/10/105022
- J. P. Verboncoeur, Plasma, Phys. Controlled Fusion 47, A231 (2005). https://doi.org/10.1088/0741-3335/47/5A/017
- C. H. Shon, J. K. Lee, H. J. Lee, Y. Yang, and T. H. Chung, IEEE T. Plasma Sci. 26, 1635-1644 (1998). https://doi.org/10.1109/27.747881
- C. H. Shon and J. K. Lee, Appl. Surf. Sci. 192, 258-269 (2002). https://doi.org/10.1016/S0169-4332(02)00030-2
- S. Kuroiwa, T. Mine, T. Yakisawa and T. Makabe, J. Vac. Sci. Technol. B 23, 2218-2221 (2005). https://doi.org/10.1116/1.2009771
- I. Kolev and A. Bogaerts, IEEE T. Plasma Sci. 34, 886-894 (2006) https://doi.org/10.1109/TPS.2006.875843
- T. Makabe and T. Yakisawa, Mater. Sci. Forum 555, 65-71 (2007). https://doi.org/10.4028/www.scientific.net/MSF.555.65
- Z. Hua-Yu and M. Zong-Xin, Chinese Phys. B 17, 1475-1479 (2008). https://doi.org/10.1088/1674-1056/17/4/055
- V. K. Decyk and T. V. Singh, Comput. Phys. Comm. 185, 708-719 (2014). https://doi.org/10.1016/j.cpc.2013.10.013
- C. K. Birdsall and A. b. Langdon, Plasma Physics vis Computer Simulation, Taylor & Francis Group (2005).
- V. Vahedi and M. Surendra, Comput. Phys. Comm. 87, 179-198 (1995). https://doi.org/10.1016/0010-4655(94)00171-W
- P. Sigmund, Phys. Rev. 184, 383-416 (1969). https://doi.org/10.1103/PhysRev.184.383
- M. P. Seah and T. S. Nunney, J. Phys. D: Appl. Phys. 43, 253001 (2010). https://doi.org/10.1088/0022-3727/43/25/253001
- R. Behrisch and W. Eckstein, Sputtering by particle Bombardment, Springer (2007).
- Y. Yamamura and H. Tawara, Atom. Data Nucl. Data 62, 149-253 (1996). https://doi.org/10.1006/adnd.1996.0005
- V. Vahedi and G. DiPeso, J. Comput. Phys. 131, 149-163 (1997). https://doi.org/10.1006/jcph.1996.5591