Journal of IKEEE (전기전자학회논문지)

Institute of Korean Electrical and Electronics Engineers (한국전기전자학회)
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High Temperature Reliability Study of Anisotropic Conductive Adhesive for Electronic Components

  • Received : 2018.03.07
  • Accepted : 2018.03.20
  • Published : 2018.03.31
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Abstract

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

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References

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