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Fabrication of compact surface structure by molar concentration on Sb-doped SnO2 transparent conducting films

안티몬 도핑된 주석 산화물 투명전도막의 몰 농도에 따른 치밀한 표면 구조 제조

  • Bae, Ju-Won (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Koo, Bon-Ryul (Program of Materials Science & Engineering, Convergence Institute of Biomedical Engineering and Biomaterials, Seoul National University of Science and Technology) ;
  • Ahn, Hyo-Jin (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 배주원 (서울과학기술대학교 신소재공학과) ;
  • 구본율 (서울과학기술대학교 의공학-바이오소재 융합 협동과정 신소재공학프로그램) ;
  • 안효진 (서울과학기술대학교 신소재공학과)
  • Received : 2018.02.14
  • Accepted : 2018.02.22
  • Published : 2018.02.28

Abstract

Sb-doped $SnO_2$ (ATO) transparent conducting films are fabricated using horizontal ultrasonic spray pyrolysis deposition (HUSPD) to form uniform and compact film structures with homogeneously supplied precursor solution. To optimize the molar concentration and transparent conducting performance of the ATO films using HUSPD, we use precursor solutions of 0.15, 0.20, 0.25, and 0.30 M. As the molar concentration increases, the resultant ATO films exhibit more compact surface structures because of the larger crystallite sizes and higher ATO crystallinity because of the greater thickness from the accelerated growth of ATO. Thus, the ATO films prepared at 0.25 M have the best transparent conducting performance ($12.60{\pm}0.21{\Omega}/{\square}$ sheet resistance and 80.83% optical transmittance) and the highest figure-of-merit value ($9.44{\pm}0.17{\times}10^{-3}{\Omega}^{-1}$). The improvement in transparent conducting performance is attributed to the enhanced carrier concentration by the improved ATO crystallinity and Hall mobility with the compact surface structure and preferred (211) orientation, ascribed to the accelerated growth of ATO at the optimized molar concentration. Therefore, ATO films fabricated using HUSPD are transparent conducting film candidates for optoelectronic devices.

Keywords

References

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