Advances in materials Research

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Analytical modeling enables explanation of paradoxical behaviors of electronic and optical materials and assemblies

  • Suhir, Ephraim (Department of Mechanical and Materials Engineering, Portland State University)
  • Received : 2017.05.30
  • Accepted : 2017.09.02
  • Published : 2017.06.25
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Abstract

Merits, attributes and challenges associated with the application of analytical modeling in electronics and photonics materials science are addressed, based mostly on the author's research during his tenure with Bell Labs, University-of-California, Portland State University, and small business innovative research (SBIR) ERS Co., USA. The emphasis is on practically important, yet often paradoxical, i.e., intuitively non-obvious, material behaviors. It is concluded that when material reliability is crucial, ability to effectively quantify it is imperative, and that analytical modeling is the most suitable, although never straightforward, technique to understand, explain and quantify material behaviors, especially in extreme, extraordinary and paradoxical situations.

Keywords

References

  1. Chen, L., Adams, J., Chu, H.W. and Fan, X.J. (2016), "Modeling of moisture over-saturation and vapor pressure in die attach film for stacked-die chip scale packages", J. Mater. Sci.: Mater. Electr., 27(1), 481-488. https://doi.org/10.1007/s10854-015-3778-5
  2. Chen, L., Jiang, T.F. and Fan, X.J. (2017), Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization. In 3D Microelectronic Packaging: From Fundamentals to Applications, Springer.
  3. Christiaens, W., Vandevelde, B., Bosman, E. and Vanfleteren, J. (2006), "Ultra-thin chip package (UTCP): 60 ${\mu}m$ thick bendable chip package, Proceedings of the 3rd International Conference on Wafer Level Packaging (WLP))".
  4. Dandu, P., Fan, X.J., Liu, Y. and Diao, C. (2010), "Finite element modeling on electro-migration of solder joints in wafer level packages", Microelectr. Reliab., 50, 547-555. https://doi.org/10.1016/j.microrel.2009.12.003
  5. Deletage, J.Y., Verdier, F., Plano, B., Deshayes, Y., Bechou, L. and Danto, Y. (2003), "Reliability estimation of BGA & CSP assemblies using degradation law model and technological parameters deviation", Microelectr. Reliab., 43(7), 1137-1144. https://doi.org/10.1016/S0026-2714(03)00101-X
  6. Deshayes, Y., Bechou, L., Deletage, J.Y., Verdier, F., Danto, Y., Laffitte, D. and Goudard, J.L. (2003), "Three-dimensional FEM simulations of thermo-mechanical stresses in 1.55 ${\mu}m$ laser modules", Microelectr. Reliab., 43(7), 1125-1136. https://doi.org/10.1016/S0026-2714(03)00099-4
  7. Fan, X.J. and Suhir, E. (2010), Moisture Sensitivity of Plastic Packages of IC Devices, Springer, New York, U.S.A.
  8. Fan, X.J. and Ranouta, A.S. (2012), "Finite element modeling of system design and testing conditions for component solder ball reliability under impact", IEEE CPMT Trans., 2(11), 1802-1810.
  9. Fan, X.J., Pei, M. and Bhatti, P.K. (2014), Thermal Stresses in Flip Chip BGA Packaging, Encyclopedia of Thermal Stresses, Springer.
  10. Fan, J.J., Qian, C., Yung, K.C., Fan, X.J., Zhang, G.Q. and Pecht, M. (2015), "Optimal design of life testing for high brightness white LEDs using the six sigma DMAIC approach", IEEE Trans. Dev. Mater. Reliab., 15(4), 576-587. https://doi.org/10.1109/TDMR.2015.2483751
  11. Fan, X.J., Chen, L., Wong, C.P, Chu, H.S. and Zhang, G.Q. (2015), "Effects of vapor pressure and superhydrophobic nanocomposite coating on microelectronics reliability", Eng., 1(3), 384-390. https://doi.org/10.15302/J-ENG-2015034
  12. Fan, X.J. (2014), Thermal Stresses in Wafer Level Packaging, Encyclopedia of Thermal Stresses, Springer.
  13. Fan X.J. and Lee, S.W.R. (2010), Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture Induced Damages in Polymeric Materials in Electronic Packaging, in Moisture Sensitivity of Plastic Packages of IC Devices, Springer, New York, U.S.A.
  14. Fan, X.J., Tee, T.Y., Shi, X.Q. and Xie, B. (2010), Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices, Moisture Sensitivity of Plastic Packages of IC Devices, Springer, New York, U.S.A.
  15. Huang, J.L., Golubovic, D.S., Koh, S., Yang, D.G., Lie, X.P., Fan, X.J. and Zhang, G.Q. (2016), "Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test", Reliab. Eng. Syst. Safety, 154, 152-159. https://doi.org/10.1016/j.ress.2016.06.002
  16. Huang, J.L., Golubovic, D.S., Koh, S., Yang, D.G., Li, X.P., Fan, X.J. and Zhang, G.Q. (2015), "Degradation modeling of mid-power white-light LEDs by using wiener process", Opt. Expr., 23(15), A966-A978. https://doi.org/10.1364/OE.23.00A966
  17. Luryi, S. and Suhir, E. (1986), "A new approach to the high-quality epitaxial growth of lattice-mismatched materials", Appl. Phys. Lett., 49(3), 140-142. https://doi.org/10.1063/1.97204
  18. Ou, Z.C., Yao, X.H., Zhang, X.Q. and Fan, X.J. (2014), "Wrinkling analysis in a film bonded to a compressible compliant substrate in large deformation", Comput. Mater. Cont., 44(3), 205-221.
  19. Ou, Z.C., Yao, X.H., Zhang, X.Q. and Fan, X.J. (2016), "Dynamic stability of flexible electronic structures under step loads", Eur. J. Mech. A: Sol., 58, 247-255. https://doi.org/10.1016/j.euromechsol.2016.02.008
  20. Ou, Z.C., Yao, X.H., Zhang, X.Q. and Fan, X.J. (2016), "Buckling of a stiff thin film on a compliant substrate under anisotropic biaxial prestrain", Sci. Chin. Phys. Mech. Astr., 59, 624601. https://doi.org/10.1007/s11433-015-5696-1
  21. Placette, M.D., Fan, X.J., Zhao, J.H. and Edwards, D. (2012), "Dual stage modeling of moisture absorption and desorption in epoxy mold compound", Microelectr. Reliab., 52, 1401-1408. https://doi.org/10.1016/j.microrel.2012.03.008
  22. Reinikainen, T. and Suhir, E. (2009), Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties.
  23. Shen, Y., Zhang, L., Zhu, W.H., Zhou, J. and Fan, X.J. (2016), "Finite-element analysis and experimental test for a capped-die flip-chip package design", IEEE Trans. Comp. Pack. Manufact. Technol., 6(9), 1308-1316. https://doi.org/10.1109/TCPMT.2016.2592947
  24. Chen, L., Adams, J., Chu, H.W. and Fan, X.J. (2016), "Modeling of moisture over-saturation and vapor pressure in die attach film for stacked-die chip scale packages", J. Mater. Sci. Mater. Electr., 27(1), 481-488. https://doi.org/10.1007/s10854-015-3778-5
  25. Shi, X.Q., Fan, X.J., Zhang, Y.L. and Zhou, W. (2010), Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques, Moisture Sensitivity of Plastic Packages of IC Devices.
  26. Suhir, E. (1985), "Linear and nonlinear vibrations caused by periodic impulses", Proceedings of the AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and Materials Conf., Orlando, Florida, April.
  27. Suhir, E. (1986), "(a) Stresses in bi-metal thermostats", ASME J. Appl. Mech., 53(3), 657-660. https://doi.org/10.1115/1.3171827
  28. Suhir, E. (1986), "(b) Calculated thermally induced stresses in adhesively bonded and soldered assemblies", Proceedings of the International Symposium on Microelectr., ISHM, Atlanta, Georgia, October.
  29. Suhir, E. (1987), "Die attachment design and its influence on the thermally induced stresses in the die and in the attachment", Proceedings of the 37th Conference on ECTC, May.
  30. Suhir, E. (1988), (a) Thermal Stress Failures in Microelectronic Components-Review and Extension, Advances in Thermal Modeling of Electronic Components and Systems, Hemisphere, New York, U.S.A.
  31. Suhir, E. (1988), "(b) An approximate analysis of stresses in multilayer elastic thin films", ASME J. Appl. Mech., 55(3), 143-148. https://doi.org/10.1115/1.3173620
  32. Suhir, E. (1988), "(c) On a paradoxical phenomenon related to beams on elastic foundation", ASME J. Appl. Mech., 55(10), 818-821. https://doi.org/10.1115/1.3173727
  33. Suhir, E. (1988), "(d) Could compliant external leads reduce the strength of a surface mounted device?", Proceedings of the 38th Conference on ECTC, May.
  34. Suhir, E. (1988), "(e) Spring constant in the buckling of dual-coated optical fibers", IEEE/OSA J. Lightw. Technol., 6(7), 1240-1244. https://doi.org/10.1109/50.4121
  35. Suhir, E. (1988), "(f) Effect of initial curvature on low temperature micro-bending in optical fibers", IEEE/OSA J. Lightw. Technol., 6(8), 1321-1327. https://doi.org/10.1109/50.4137
  36. Suhir, E. (1989), "(a) Analytical modeling in structural analysis for electronic packaging: its merits, shortcomings and interaction with experimental and numerical techniques", ASME J. Electr. Pack., 111(2), 157-161. https://doi.org/10.1115/1.3226522
  37. Suhir, E. (1989), "(b) Interfacial stresses in bi-metal thermostats", ASME J. Appl. Mech., 56(3), 595-600. https://doi.org/10.1115/1.3176133
  38. Suhir, E. (1990), "(a) Mechanical approach to the evaluation of the low temperature threshold of added transmission losses in single-coated optical fibers", IEEE/OSA J. Lightw. Technol., 8(6), 863-868. https://doi.org/10.1109/50.54502
  39. Suhir, E. (1990), "(b) Buffering effect of fiber coating and its influence on the proof-test load in optical fibers", Appl. Opt., 29(18), 2682-2685. https://doi.org/10.1364/AO.29.002682
  40. Suhir, E., Bubel, G.M. and Tuminaro, R.D. (1991), "Predicted curvature of the glass fiber from the measured curvature of its coating", IEEE/OSA J. Lightw. Technol., 9(6), 701-708. https://doi.org/10.1109/50.81971
  41. Suhir, E. (1991), "(a) Mechanical behavior of materials in microelectronic and fiber optic systems: application of analytical modeling", MRS Symp. Proc., 226.
  42. Suhir, E. (1991), "(b) Nonlinear dynamic response of a flexible printed circuit board to shock loads applied to its support contour", Proceedings of the 41st Conference on ECTC, May.
  43. Suhir, E. (1992), "(a) Response of a flexible printed circuit board to periodic shock loads applied to its support contour", ASME J. Appl. Mech., 59(2), 253-259. https://doi.org/10.1115/1.2899498
  44. Suhir, E. (1992), "(b) Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards used in avionic packaging", J. Sol. Struct., 29(1), 41-55. https://doi.org/10.1016/0020-7683(92)90094-A
  45. Suhir, E. (1992), "(c) Mechanical behavior and reliability of solder joint interconnections in thermally matched assemblies", Proceedings of the 42nd Conference on ECTC, May.
  46. Suhir, E. (1992), "(c) Predicted bow of plastic packages of integrated circuit (IC) devices", Proceedings of the 50th SPE Conference, Detroit, Michigan, May.
  47. Suhir, E. (1992), "(d) The effect of the nonlinear behavior of the material on two-point bending in optical glass fibers", ASME J. Electr. Pack., 114(2), 246-250. https://doi.org/10.1115/1.2906425
  48. Suhir, E. (1992), "(e) Elastic stability, free vibrations, and bending of optical glass fibers: Effect of the nonlinear stress-strain relationship", Appl. Opt., 31(24), 5080-5085. https://doi.org/10.1364/AO.31.005080
  49. Suhir, E. (1993), "Could the curvature of an optical glass fiber be different from the curvature of its coating?", J. Sol. Struct., 30(17), 2425-2435. https://doi.org/10.1016/0020-7683(93)90127-S
  50. Suhir, E. (1994), "(a) Pull testing of a glass fiber soldered into a ferrule: How long should the test specimen be?", Appl. Opt., 33(19), 4109-4112. https://doi.org/10.1364/AO.33.004109
  51. Suhir, E. (1994), "(b) Thermally induced stresses in an optical glass fiber soldered into a ferrule", IEEE/OSA J. Lightw. Technol., 12(10), 1766-1770. https://doi.org/10.1109/50.337488
  52. Suhir, E., Mishkevich, V. and Anderson, J. (1995), How Large Should a Periodic External Load be to Cause Appreciable Microbending Losses in a Dual-Coated Optical Fiber?, Structural Analysis in Microelectronics and Fiber Optics, ASME Press.
  53. Suhir, E. (1995), "(a) How compliant should a die-attachment be to protect the chip from substrate (card) bowing?", ASME J. Electr. Pack., 117(1), 88-92. https://doi.org/10.1115/1.2792073
  54. Suhir, E. (1995), "(b) Shock protection with a nonlinear spring", IEEE CPMT Trans. Adv. Pack. Part B, 18(2), 430-437.
  55. Suhir, E. (1996), "(a) Dynamic response of a one-degree-of-freedom linear system to a shock load during drop tests: Effect of viscous damping", IEEE CPMT Trans. Part A, 19(3), 435-440.
  56. Suhir, E. (1996), "(b) Shock-excited vibrations of a conservative duffing oscillator with application to shock protection in portable electronics", J. Sol. Struct., 33(24), 3627-3642. https://doi.org/10.1016/0020-7683(95)00199-9
  57. Suhir, E. (1996), "(c) Flex circuit vs regular substrate: Predicted reduction in the shearing stress in solder joints", Proceedings of the 3rd International Conference on Flexible Circuits FLEXCON 96, San-Jose, California, U.S.A., October.
  58. Suhir, E. and Weld, J. (1997), Electronic Package with Reduced Bending Stress, US Patent #5,627,407.
  59. Suhir, E. (1997), "(a) Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?", IEEE CPMT Trans. Part A, 20(4), 513-517.
  60. Suhir, E. (1997), "(b) The future of microelectronics and photonics, and the role of mechanics and materials", Proceedings of the EPTC'97, Singapore, October.
  61. Suhir, E. (1997), (c) Applied Probability for Engineers and Scientists, McGraw Hill, New York, U.S.A.
  62. Suhir, E. (1997), "(d) Dynamic response of microelectronics and photonics systems to shocks and vibrations", Proceedings of the INTERPack'97, Hawaii, U.S.A., June.
  63. Suhir, E. (1998), "(a) Adhesively bonded assemblies with identical non-deformable adherends and inhomogeneous adhesive layer: Predicted thermal stresses in the adhesive", J. Reinf. Plast. Comp., 17(14).
  64. Suhir, E. (1998), (b) Critical Strain and Post-Buckling Stress in Polymer coated Optical Fiber Interconnect: What Could be Gained by Using Thicker Coating?, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, ASME Press, Paris, France, November-December.
  65. Suhir, E. (1998), "(c) Bending stress in an optical fiber interconnect experiencing significant ends offset", Proceedings of the MRS Symposium, 531.
  66. Suhir, E. (1998), "(d) Optical fiber interconnect subjected to a not-very-small end offset: Effect of the reactive tension", Proceedings of the MRS Symposium, 531.
  67. Suhir, E. (1998), "(e) Optical glass fiber bent on a cylindrical surface", Proceedings of the MRS Symposium, 531.
  68. Suhir, E. (1998), "(f) Coated optical fiber interconnect subjected to the end offset and axial loading", International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, ASME Press, Paris, France, November-December.
  69. Suhir, E. (1999), "(a) Adhesively bonded assemblies with identical non-deformable adherends: Predicted thermal stresses in the adhesive layer", Compos. Interf., 6(2).
  70. Suhir, E. (1999), "(b) Thermal stress failures in microelectronics and photonics: Prediction and prevention", Fut. Circ. Int., 5.
  71. Suhir, E. (2000), "(a) Microelectronics and photonics-the future", Microelectr. J., 31, 11-12.
  72. Suhir, E. (2000), "(b) Predicted stresses in, and the bow of, a circular substrate/thin-film system subjected to the change in temperature", J. Appl. Phys., 88(5), 2363-2370. https://doi.org/10.1063/1.1286096
  73. Suhir, E. (2000), "(c) Adhesively bonded assemblies with identical non-deformable adherends and "piecewise continuous" adhesive layer: Predicted thermal stresses and displacements in the adhesive", J. Sol. Struct., 37.
  74. Suhir, E. (2000), "(d) Optical fiber interconnect with the ends offset and axial loading: What could be done to reduce the tensile stress in the fiber?", J. Appl. Phys., 88(7), 3865-3871. https://doi.org/10.1063/1.1290707
  75. Suhir, E. (2001), (a) Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly, US Patent #6,239,382.
  76. Suhir, E. (2001), "(b) Thermo-mechanical stress modeling in microelectronics and photonics", Electr. Cool., 7(4).
  77. Suhir, E. (2001), "(c) Analysis of interfacial thermal stresses in a tri-material assembly", J. Appl. Phys., 89(7), 3685-3694. https://doi.org/10.1063/1.1350623
  78. Suhir, E. (2001), "(d) Thermal stress in a polymer coated optical glass fiber with a low modulus coating at the ends", J. Mater. Res., 16(10), 2996-3004. https://doi.org/10.1557/JMR.2001.0411
  79. Suhir, E. (2001), "(e) Thermal stress in a bi-material assembly adhesively bonded at the ends", J. Appl. Phys., 89(1).
  80. Suhir, E. (2002), (a) Bi-material Assembly Bonded at the Ends and Fabrication Method, US Patent #6,460,753.
  81. Suhir, E. (2002), (b) Analytical Stress-Strain Modeling in Photonics Engineering: Its Role, Attributes and Interaction with the Finite-Element Method, Laser Focus World, May.
  82. Suhir, E. (2002), "(c) Could shock tests adequately mimic drop test conditions?", ASME J. Electr. Pack., July.
  83. Suhir, E. (2003), "(a) Thermal stress in an adhesively bonded joint with a low modulus adhesive layer at the ends", J. Appl. Phys., April.
  84. Suhir, E. (2003), "(b) Bow free adhesively bonded assemblies: Predicted stresses", Electrotech. Informationtech., 120(6), June.
  85. Suhir, E. (2003), (c) Optical Fiber Interconnects Having Offset Ends with Reduced Tensile Strength and Fabrication Method, US Patent #6,606,434.
  86. Suhir, E. (2005), "(a) Analytical thermal stress modeling in physical design for reliability of micro- and opto-electronic systems: Role, attributes, challenges, results", Proceedings of the Therminic Conference, Lago Maggiore, Italy, September.
  87. Suhir, E. (2005), "(b) Reliability and accelerated life testing", Semicond. Int.
  88. Suhir, E. (2006), Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer, Modeling and Simulation in Materials Science and Engineering, 14.
  89. Suhir, E., Wong, C.P. and Lee, Y.C. (2008), Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, Springer, New York, U.S.A.
  90. Suhir, E. and Reinikainen, T. (2008), "On a paradoxical situation related to lap shear joints: Could transverse grooves in the adherends lead to lower interfacial stresses?", J. Appl. Phys. D, 41.
  91. Suhir, E. and Arruda, L. (2009), "The coordinate function in the problem of the nonlinear dynamic response of an elongated printed circuit board (PCB) to a drop impact applied to its support contour", Eur. J. Appl. Phys., 48(2),
  92. Suhir, E. and Reinikainen, T. (2009), "(a) Interfacial stresses in a lap shear joint (LSJ): The transverse groove effect (TGE)", JSME J. Sol. Mech. Mater. Eng., 3(6).
  93. Suhir, E. and Reinikainen, T. (2009), "(b) Nonlinear dynamic response of a "flexible-and-heavy" printed circuit board (PCB) to an impact load applied to its support contour", J. Appl. Phys. D, 42(4), 045506. https://doi.org/10.1088/0022-3727/42/4/045506
  94. Suhir, E. (2009), "(a) Analytical thermal stress modeling in electronic and photonic systems", ASME AMR, 62(4).
  95. Suhir, E. (2009), "(b) On a paradoxical situation related to bonded joints: Could stiffer mid-portions of a compliant attachment result in lower thermal stress?", J. Sol. Mech. Mater. Eng., 3(7).
  96. Suhir, E. (2009), "(c) Thermal stress in a bi-material assembly with a "piecewise-continuous" bonding layer: Theorem of three axial forces", J. Appl. Phys. D, 42.
  97. Suhir, E. (2009), "(d) Stretchable electronics: Does one need a good thermal expansion match between the Si die and the plastic carrier?", Proceedings of the 59th Conference on ECTC.
  98. Suhir, E. (2009), "(e) Stretchable electronics: Predicted thermo-mechanical stresses in the die", Volume Dedicated to the 60th Birthday of Prof. B. Michel, Fraunhofer Institute, Berlin, Germany.
  99. Suhir, E. and Arruda, L. (2010), "Could an impact load of finite duration acting on a duffing oscillator be substituted with an instantaneous impulse?", J. Sol. Mech. Mater. Eng., 4(9).
  100. Suhir, E. and Reinikainen, T. (2010), "Interfacial stresses in a lap shear joint (LSJ): The transverse groove effect (TGE) and the predicted peeling stress", J. Sol. Mech. Mater. Eng., 4(8), 1116-1130. https://doi.org/10.1299/jmmp.4.1116
  101. Suhir, E. (2010), "(a) Predicted stresses in die-carrier assemblies in stretchable electronics: Is there an incentive for using a compliant bond?", ZAMM, 10.
  102. Suhir, E., Gu, C. and Cao, L. (2011), "Predicted thermal stress in a circular adhesively bonded assembly with identical adherends", ASME J. Appl. Mech., 79(1), 7-18.
  103. Suhir, E. (2011), (a) Linear Response to Shocks and Vibrations, John Wiley, Hoboken, New Jersey, U.S.A.
  104. Suhir, E. (2011), "(b) Thermal stress failures: Predictive modeling explains the reliability physics behind them, IMAPS Advanced Microelectronics", 38(4).
  105. Suhir, E. (2011), "(c) Predictive modeling of the dynamic response of electronic systems to shocks and vibrations", ASME Appl. Mech. Rev., 63(5), 050803.
  106. Suhir, E. (2011), "(d) Predictive modeling is a powerful means to prevent thermal stress failures in electronics and photonics", ChipScale Rev., 15(4).
  107. Suhir, E. (2011), "(e) Stresses in bi-material GaN assemblies", J. Appl. Phys., 110.
  108. Suhir, E. (2011), "(f) Predicted response of the die-carrier assembly to the combined action of tension and bending applied to the carrier in flexible electronics", ASME J. Appl. Mech., 79(1).
  109. Suhir, E. (2011), "(g) Analysis of a pre-stressed bi-material accelerated life test (ALT) specimen", ZAMM, 91(5), 371-385. https://doi.org/10.1002/zamm.201000101
  110. Suhir, E. and Shakouri, A. (2012), "Assembly bonded at the ends: Could thinner and longer legs result in a lower thermal stress in a thermoelectric module (TEM) design?", ASME J. Appl. Mech., 79(6), 061010. https://doi.org/10.1115/1.4006597
  111. Suhir, E. (2012), (a) Thermal Stress in Electronics and Photonics: Prediction and Prevention, Therminic, Budapest, Hungary.
  112. Suhir, E., Bechou, L. and Levrier, B. (2013), "Predicted size of an inelastic zone in a ball-grid-array assembly", ASME J. Appl. Mech., 80, 021007. https://doi.org/10.1115/1.4007476
  113. Suhir, E. and Shakouri, A. (2013), "Predicted thermal stresses in a multi-leg thermoelectric module (TEM) design", ASME J. Appl. Mech., 80.
  114. Suhir, E. and Bechou, L. (2013), "Saint-Venant‟s principle and the minimum length of a dual-coated optical fiber specimen in reliability (proof) testing", Proceedings of the ESREF Conference, Arcachon, France.
  115. Suhir, E. (2013), "(a) Structural dynamics of electronics systems", Mod. Phys. Lett. B, 27(7), 1330004. https://doi.org/10.1142/S0217984913300044
  116. Suhir, E. (2013), (b) Thermal Stress in a Tri-Material Assembly with Application to Si-Based Photovoltaic Module (PVM), Encyclopedia of Thermal Stresses, Springer, New York, U.S.A.
  117. Suhir, E. (2013), "(c) Lattice-misfit stresses in a circular bi-material GaN assembly", ASME J. Appl. Mech., 80(1), 014505.
  118. Suhir, E. (2013), (d) Thermal Stress in a Multi-Leg Thermoelectric Module (TEM) Design, Encyclopedia of thermal stresses, Springer, New York, U.S.A.
  119. Suhir, E. (2013), (e) Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product, Circuits Assembly, July.
  120. Suhir, E. (2013), "(g) Assuring aerospace electronics and photonics reliability: What could and should be done differently", Proceedings of the IEEE Aerospace Conference, Big Sky, MT, U.S.A., March.
  121. Suhir, E. and Bensoussan, A. (2014), "Quantified reliability of aerospace optoelectronics", SAE Int. J. Aerosp., 7(1).
  122. Suhir, E. and Nicolics, J. (2014), "Analysis of a bow-free pre-stressed test specimen", ASME J. Appl. Mech., 81(11), 114502. https://doi.org/10.1115/1.4028551
  123. Suhir, E. (2014), "(c) Fiber optics engineering: Physical design for reliability", Facta Universit.: Electr. Energet., 27(2), 153-182. https://doi.org/10.2298/FUEE1402153S
  124. Suhir, E., Bechou, L. and Nicolics, J. (2015), "Thermal stress in an electronic package sandwiched between two identical substrates", Proceedings of the IEEE Aerospace Conference, Big Sky, Montana, March.
  125. Suhir, E., Bensoussan, A. and Nicolics, J. (2015), "(b) Bow-free pre-stressed ALT specimen", Proceedings of the SAE Conference, Seattle, U.S.A., September.
  126. Suhir, E., Khatibi, G. and Nicolics, J. (2015), "Predictive modeling of the lattice-misfit stresses in GaN film grown on a circular substrate", Proceedings of the MPPE Conference, Leoben, Austria, November.
  127. Suhir, E., Ghaffarian, R. and Nicolics, J. (2015), "Could application of column-grid-array technology result in inelastic-strain-free state-of-stress in solder material?", JMSE, 26(12), 10062-10067.
  128. Suhir, E. (2015), "(a) Analytical predictive modeling in fiber optics structural analysis: Review and extension", SPIE, San-Francisco, U.S.A., February.
  129. Suhir, E. (2015), "(b) Analytical stress modeling for TSVs in 3D packaging", Semi-Term, San-Jose, March.
  130. Suhir, E. (2015), "(c) Predicted Thermal and Lattice-Mismatch Stresses, Handbook of Crystal Growth, Elsevier, New York, U.S.A.
  131. Suhir, E. (2015), "(d) Stress related aspects of the physics of GaN material growth", SPIE, San-Francisco, U.S.A., February.
  132. Suhir, E. (2015), "(g) Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?", Eur. Phys. J. Appl. Phys., 71(3), 31301. https://doi.org/10.1051/epjap/2015140492
  133. Suhir, E. (2015), "(h) Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with low modulus solder at its ends", JMSE, 26(12), 9680-9688.
  134. Suhir, E., Ghaffarian, R., Bechou, L. and Nicolics, J. (2016), "Column-grid-array (CGA) technology could lead to a highly reliable package design", Proceedings of the IEEE Aerospace Conference, Big Sky, Montana, U.S.A., March.
  135. Suhir, E., Ghaffarian, R. and Nicolics, J. (2016), "(a) Could thermal stresses in an inhomogeneous BGA/CGA system be predicted using a model for a homogeneously bonded assembly?", JMSE, 27(1), 570-579.
  136. Suhir, E., Ghaffarian, R. and Nicolics, J. (2016), "(b) Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design", JMSE, 27(3), 2430-2441.
  137. Suhir, E. and Ghaffarian, R. (2016), "(a) Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with epoxy adhesive at its ends", JMSE, 27(5).
  138. Suhir, E. and Nicolics, J. (2016), "Power core (PC) embedding a plurality of IC devices and sandwiched between two dissimilar insulated metal substrates (IMS‟): Predicted thermal stresses", JMSE, 27(7), 7646-7656.
  139. Suhir, E., Yi, S., Khatibi, G. Nicolics, J. and Lederer, M. (2016), "Semiconductor film grown on a circular substrate: Predictive modeling of lattice-misfit stresses", JMSE, 27(9), 9356-9362.
  140. Suhir, E. and Ghaffarian, R. (2016), "(b) Dynamic response of electronic materials to impact loading: Review", ZAMM, in Print.
  141. Suhir, E. and Ghaffarian, R. (2016), "(c) Board level drop test: Exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact", JMSE, 27(9), 9423-9430.
  142. Suhir, E. and Ghaffarian, R. (2016), "(d) Column-grid-array (CGA) vs. ball-grid-array (BGA): Board-level drop test and the expected dynamic stress in the solder material", JMSE, 27(11), 11572-11582.
  143. Suhir, E. and Ghaffarian R. (2016), "(e) Predictive modeling of the dynamic response of electronic systems to impact loading: Review", ZAMM, in Print.
  144. Suhir, E., Ghaffarian, R. and Yi, S. (2016), "QFN assembly: Effect of inhomogeneous bond and thermal stress minimization", JMSE, in Print.
  145. Suhir, E., Morris, J., Wang, L. and Yi, S. (2016), "Could the dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?", JMSE, 27(7), 6697-6702.
  146. Suhir, E. (2016), "(a) Predicted lattice-misfit stresses in a gallium-nitride (GaN) film", Proceedings of the International Rel. Phys. Symposium, Pasadena, California, U.S.A.
  147. Suhir, E. (2016), "(b) Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: Optimized stress relief", JMSE, 27(5), 4816-4825.
  148. Suhir, E. (2016), "(c) Expected stress relief in a bi-material inhomogeneously bonded assembly with a lowmodulus-and/or-low-fabrication-temperature bonding material at the ends", JMSE, 27(6), 5563-5574.
  149. Suhir, E. (2016), "(d) Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: Optimized stress relief", JMSE, 27(7), 4816-4825.
  150. Suhir, E. (2016), "(e) Analytical modeling occupies a special place in the modeling effort", J. Phys. Math., 7(1).
  151. Suhir, E. (2016), "(f) How many peripheral solder joints in a surface mounted design are expected to experience inelastic strains?", J. Electr. Mater., in Print.
  152. Suhir, E. (2016), "(g) Probabilistic palmgren-miner rule, with application to solder materials experiencing elastic deformations", JMSE, in Print.
  153. Sun, B., Fan, X.J., Qian, C. and Zhang, G.Q. (2016), "PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers", IEEE Trans. Industr. Electr., 63(11), 6726-6735. https://doi.org/10.1109/TIE.2016.2581156
  154. Sun, B., Fan, X.J., Ye, H.Y., Fan, J.J., Qian, C., Van Driel, W.D. and Zhang, G.Q. (2017), A Novel Lifetime Prediction for Integrated LED Lamps by Electronic-Thermal Simulation, Reliability Engineering & System Safety,163, 14-21. https://doi.org/10.1016/j.ress.2017.01.017
  155. Timoshenko, S.P. (1925), "Analysis of bi-metal thermostats", J. Opt. Soc. Am., 11.
  156. Zhang, G.Q., Van Driel, W.D. and Fan, X.J. (2006), Mechanics of Microelectronics, Springer.
  157. Zhou, C.Y., Yu, T.X. and Suhir, E. (2009), "Design of shock table tests to mimic real-life drop conditions", IEEE CPMT Trans., 32(4), 832-837.
  158. Zhou, J., Tee, T.Y. and Fan, X.J. (2010), Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis, Moisture Sensitivity of Plastic Packages of IC Devices, Springer, New York, U.S.A.