한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제50권3호
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  • Pages.164-169
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  • 2017
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지
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Adhesion of Cu/Interlayer/Polyimide Flexible Copper Clad Laminate Depending on the Ni-Cr-X Interlayers

  • Kim, Si Myeong (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Jo, Yoo Shin (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Kim, Sung June (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Kim, Sang Ho (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
  • 투고 : 2017.04.10
  • 심사 : 2017.06.19
  • 발행 : 2017.06.30
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초록

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

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참고문헌

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