References
- J. S. Park, W.-J. Maeng, H.-S. Kim and J.-S. Park, Thin Solid Films, 520, 1679 (2012). https://doi.org/10.1016/j.tsf.2011.07.018
- J.-S. Park, H. Kim and I.-D. Kim, J. Electroceram., 32, 117 (2014). https://doi.org/10.1007/s10832-013-9858-0
- E. Fortunato, P. Barquinha and R. Martins, Adv. Mater., 24, 2945 (2012). https://doi.org/10.1002/adma.201103228
- S. J. Kim, S. H. Yoon and H. J. Kim, Jpn. J. Appl. Phys., 53, 02BA02 (2014). https://doi.org/10.7567/JJAP.53.02BA02
- J. Park, Y. S. Kim, K.-C. Ok, Y. C. Park, H. Y. Kim, J.-S. Park and H.-S. Kim, Sci. Rep., 6, 24787 (2016). https://doi.org/10.1038/srep24787
- G. Adamopoulos, A. Bashir, S. Thomas, W. P. Gillin, S. Georgakopoulos, M. Shkunov, M. A. Baklar, N. Stingelin, R. C. Maher, L. F. Cohen, D. D. C. Bradley and T. D. Anthopoulos, Adv. Mater., 22, 4764 (2010). https://doi.org/10.1002/adma.201001444
- Y.-H. Kim, J.-S. Heo, T.-H. Kim, S. Park, M.-H. Yoon, J. Kim, M. S. Oh, G.-R. Yi, Y.-Y. Noh and S. K. Park, Nature, 489, 128 (2012). https://doi.org/10.1038/nature11434
- B. D. Ahn, J.-S. Park and K. B. Chung, Appl. Phys. Lett., 105, 163505 (2014). https://doi.org/10.1063/1.4899144
- A. Indluru, K. E. Holbert and T. L. Alford, Thin Solid Films, 539, 342 (2013). https://doi.org/10.1016/j.tsf.2013.04.148
- G. H. Kim, B. D. Ahn, H. S. Shin, W. H. Jeong, H. J. Kim and H. J. Kim, Appl. Phys. Lett., 94, 233501 (2009). https://doi.org/10.1063/1.3151827
- H. Pu, Q. Zhou, L. Yue and Q. Zhang, Semicond. Sci. Technol., 28, 105002 (2013). https://doi.org/10.1088/0268-1242/28/10/105002
- L. Petti, N. Munzenrieder, C. Vogt, H. Faber, L. Buthe, G. Cantarella, F. Bottacchi, T. D. Anthopoulos and G. Troster, Appl. Phys. Rev., 3, 021303 (2016). https://doi.org/10.1063/1.4953034
- Y. J. Kim, B. S. Yang, S. Oh, S. J. Han, H. W. Lee, J. Heo, J. K. Jeong and H. J. Kim, ACS Appl. Mater. Interfaces, 5, 3255 (2013). https://doi.org/10.1021/am400110y
- H.-W. Park, M.-J. Choi, Y. Jo and K.-B. Chung, Appl. Surf. Sci., 321, 520 (2014). https://doi.org/10.1016/j.apsusc.2014.09.180
- Y. J. Tak, B. D. Ahn, S. P. Park, S. J. Kim, A. R. Song, K.-B. Chung and H. J. Kim, Sci. Rep., 6, 21869 (2016). https://doi.org/10.1038/srep21869
- K. Jeon, S. W. Shin, J. Jo, M. S. Kim, J. C. Shin, C. Jeong, J. H. Lim, J. Song, J. Heo and J. H. Kim, Curr. Appl. Phys., 14, 1591 (2014). https://doi.org/10.1016/j.cap.2014.08.022
- H.-W. Park, B.-H. Jun, D. Choi and K.-B. Chung, Jpn. J. Appl. Phys., 55, 115701 (2016). https://doi.org/10.7567/JJAP.55.115701
- B. K. Kim, J. S. Park, D. H. Kim and K. B. Chung, Appl. Phys. Lett., 104, 182106 (2014). https://doi.org/10.1063/1.4875044
- K.-C. Ok, Y. Park, K.-B. Chung and J.-S. Park, Appl. Phys. Lett., 103, 213501 (2013). https://doi.org/10.1063/1.4831783
- K. Park, H.-W. Park, H. S. Shin, J. Bae, K.-S. Park, I. Kang, K.-B. Chung and J.-Y. Kwon, IEEE Trans. Electron Devices, 62, 2900 (2015). https://doi.org/10.1109/TED.2015.2458987